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Recovery method for silicon carbide and polyethyleneglycol cutting fluids in waste cutting mortar for silicon wafer

A silicon wafer cutting and recycling method technology, applied in the direction of silicon carbide, carbide, lubricating composition, etc., can solve the problems of unstable quality of recycled products, affecting application, etc., and achieve the effect of light pollution and reduced emissions

Inactive Publication Date: 2015-03-11
ZHEJIANG YUHUI SOLAR ENERGY SOURCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This recovery method still produces a large amount of sewage with a relatively serious environmental pollution during the recovery process, and the quality of the recovered product is still unstable, which affects its application.

Method used

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  • Recovery method for silicon carbide and polyethyleneglycol cutting fluids in waste cutting mortar for silicon wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] According to the mass ratio of 0.5:1, water was added to 1500# monocrystalline silicon chip cutting waste mortar and stirred, and then the first stage centrifugal separation was carried out with a horizontal centrifuge at a speed of 2000r / min to obtain polyethylene glycol-containing The first-stage centrifugal liquid and the first-stage centrifugal solid particles containing silicon carbide;

[0077] According to the mass ratio of 1:1, dilute the first-stage centrifugal solid particles with water at 60°C, stir for 30 minutes, and then use a vertical centrifuge to perform second-stage centrifugal separation at a speed of 2000r / min, and obtain the second stage after 40 minutes. centrifugation of solid particles and secondary centrifugate;

[0078] Reuse the second-stage centrifugal liquid, add it to 1500# monocrystalline silicon wafer cutting waste mortar and stir, according to the mass ratio of 1:1, wash the second-stage centrifugal solid particles at 65°C for the first-...

Embodiment 2

[0086] According to the mass ratio of 0.5:1, add water to 1200# polysilicon chip cutting waste mortar and stir, and after magnetic adsorption, use a horizontal centrifuge to perform first-stage centrifugal separation at a speed of 3000r / min to obtain the first-stage centrifugate and first-stage centrifuged solid particles;

[0087] According to the mass ratio of 1:1, dilute the first-stage centrifugal solid particles with water at 70°C, stir for 60 minutes, and then use a vertical centrifuge to perform second-stage centrifugal separation at a speed of 4000r / min, and obtain the second stage after 30 minutes. centrifugation of solid particles and secondary centrifugate;

[0088] Reuse the second-stage centrifugal liquid, add it to 1200# polysilicon chip cutting waste mortar and stir it. According to the mass ratio of 1:1, wash the second-stage centrifugal solid particles at 75°C for the first-stage water washing. After 60 minutes, use a vertical The centrifuge performs the thir...

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Abstract

The invention provides a recovery method for silicon carbide and polyethyleneglycol cutting fluids, which comprises the following steps: mixing waste cutting mortar for silicon wafer and water and performing second-stage solid and liquid separation, diluting first-stage solid particles with water, then performing second-stage solid and liquid separation, reusing the second-stage suspension liquid for mixing, performing first-stage water wash on the second stage solid particles, then performing third-stage centrifugal separation, reusing the third-stage centrifugal separation liquid for dilution, performing second-stage water wash on the third-stage centrifugal solid particles, then performing fourth-stage centrifugal separation, reusing the fourth-stage centrifugal liquid for first-stage water wash, drying and screening the fourth-stage centrifugal solid particles to obtain silicon carbide, performing filtration, decoloration and resin exchange on the first-stage suspension liquid, and performing reduced pressure distillation and thin film evaporation in sequence to acquire the polyethyleneglycol cutting fluid, the reduced pressure distillation water and the thin film evaporation water, wherein the reduced pressure distillation water is used for the second-stage water wash, and the thin film evaporation water is used for the first-stage water wash. The recovery method remarkably reduces the pollution degree of the sewage, and is beneficial to environment protection.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cutting, in particular to a method for recovering silicon carbide and polyethylene glycol cutting fluid in silicon wafer cutting waste mortar. Background technique [0002] Silicon wafers are the main production material in industries such as semiconductors and solar energy, and are usually obtained by cutting silicon rods. In the process of cutting silicon rods, the cutting mortar is often composed of silicon carbide and polyethylene glycol cutting fluid, so silicon carbide and polyethylene glycol cutting fluid are included in the silicon wafer cutting waste mortar. If the silicon wafer cutting waste mortar is directly discarded, it will not only pollute the environment, but also cause waste of components such as silicon carbide and polyethylene glycol cutting fluid, and increase production costs. Therefore, the silicon carbide and polyethylene glycol in the silicon wafer cutting waste mort...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01B31/36C10M175/00C01B32/956
Inventor 杨长剑莘双银周君支田田
Owner ZHEJIANG YUHUI SOLAR ENERGY SOURCE
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