Copper plating process

The invention discloses a copper plating process which comprises the following steps: (1) removing dust and oil from a baseline; (2) pickling and phosphorizing; (3) washing with water; (4) passivating; (5) plating tin, that is, putting the baseline in a copper plating solution at the temperature of 20-40 DEG C immediately after washing and passivating under such conditions that the transfer speed is controlled to be 2-5 m/s and the current density is controlled to be 5-15 a/dm<2>; (6) washing with water; and (7) drying, winding and packaging. The process disclosed by the invention is reasonable, the copper coating layer is uniform and high in bonding strength, and the service cost is low.