Copper plating process
A process and copper plating technology, applied in the field of copper plating process, can solve the problems of high copper price and high use cost, and achieve the effects of uniform copper plating layer, low use cost and reasonable process
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[0008] A copper plating process, comprising the following steps, 1. Dedusting and degreasing the baseline, 2. Pickling and phosphating, 3. Washing, 4. Passivation, 5. Tin plating, and immediately putting the baseline after cleaning and passivation into temperature In the copper plating solution at 20℃~40℃, the transmission speed is controlled at 2~5m / s, and the current density is controlled at 5~15a / dm 2 , 6, washing, 7, drying winding packaging.
[0009] Described copper-plating process, its copper-plating solution is distributed according to mass percentage: copper hydroxide 10g / L, potassium hydroxide 100g / L, ethylene glycol 100g / L, tripotassium citrate 20g / L and surplus The water is fully stirred and mixed, the current density is 10 / dm 2 , the pH value is 7, and the temperature is controlled at 40°C.
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