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Copper plating process

A process and copper plating technology, applied in the field of copper plating process, can solve the problems of high copper price and high use cost, and achieve the effects of uniform copper plating layer, low use cost and reasonable process

Inactive Publication Date: 2013-07-03
李振萍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Pure copper wire has the characteristics of good electrical conductivity and high transmission efficiency, but the price of copper is high and the cost of use is high. We currently need a copper-plated wire production process with excellent electrical conductivity of copper wire

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] A copper plating process, comprising the following steps, 1. Dedusting and degreasing the baseline, 2. Pickling and phosphating, 3. Washing, 4. Passivation, 5. Tin plating, and immediately putting the baseline after cleaning and passivation into temperature In the copper plating solution at 20℃~40℃, the transmission speed is controlled at 2~5m / s, and the current density is controlled at 5~15a / dm 2 , 6, washing, 7, drying winding packaging.

[0009] Described copper-plating process, its copper-plating solution is distributed according to mass percentage: copper hydroxide 10g / L, potassium hydroxide 100g / L, ethylene glycol 100g / L, tripotassium citrate 20g / L and surplus The water is fully stirred and mixed, the current density is 10 / dm 2 , the pH value is 7, and the temperature is controlled at 40°C.

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PUM

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Abstract

The invention discloses a copper plating process which comprises the following steps: (1) removing dust and oil from a baseline; (2) pickling and phosphorizing; (3) washing with water; (4) passivating; (5) plating tin, that is, putting the baseline in a copper plating solution at the temperature of 20-40 DEG C immediately after washing and passivating under such conditions that the transfer speed is controlled to be 2-5 m / s and the current density is controlled to be 5-15 a / dm<2>; (6) washing with water; and (7) drying, winding and packaging. The process disclosed by the invention is reasonable, the copper coating layer is uniform and high in bonding strength, and the service cost is low.

Description

technical field [0001] The invention relates to a copper plating process. Background technique [0002] Pure copper wire has the characteristics of good electrical conductivity and high transmission efficiency, but the price of copper is high and the cost of use is high. We currently need a copper-plated wire production process with excellent electrical conductivity of copper wire. Contents of the invention [0003] The object of the present invention is to provide a copper plating process with reasonable process, uniform copper plating layer, high bonding strength and good electrical conductivity. [0004] Technical solution of the present invention is: [0005] A copper plating process, characterized in that: comprising the following steps, 1, dedusting and degreasing the baseline, 2, pickling and phosphating, 3, washing with water, 4, passivation, 5, tin plating, about to clean the passivated baseline Immediately put it into the copper plating solution at a temperatur...

Claims

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Application Information

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IPC IPC(8): C25D7/06C25D3/38C25D3/30
Inventor 李振萍
Owner 李振萍
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