Testing method for circuit board hole solder
A test method and circuit board technology, applied in the direction of material resistance, etc., can solve problems such as difficulty in slicing and polishing, difficulty in making slicing, cumbersome slicing, etc., and achieve the effect of easy operation
Inactive Publication Date: 2015-05-27
QING DING PRECISION ELECTRONICS HUAIAN CO LTD +1
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AI Technical Summary
Problems solved by technology
Solder cracks in the holes or lack of tin in the holes are difficult to detect through appearance inspection. Generally, it is necessary to make slices and observe them with a microscope. The production of slices is relatively cumbersome, and generally requires processes such as glue filling, curing, rough grinding, and fine grinding. It can only be observed under a microscope, and the production of slices requires certain experience and technology. It is difficult for inexperienced operators to make slices, and it is difficult to polish the slices evenly and uniformly. The quality of the slices will directly affect the quality of the slices. Sample quality research and correctness of judgment
Method used
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Embodiment Construction
[0014] The following will combine figure 1 And the embodiment, the test method for the poor soldering in the hole of the circuit board provided by the technical solution is further described in detail.
[0015] The test method for poor soldering in the circuit board hole includes the following steps:
[0016] Step 1: provide a circuit board 10 to be tested.
[0017] Please also refer to Figure 2 to Figure 3 , the circuit board 10 to be tested includes a base material 110, the material of the base material 110 can be a reinforcing material such as glass fiber cloth base, paper base, composite base, aramid fiber non-woven fabric base, synthetic fiber base, etc. Or a resin base material that does not contain a reinforcing material, or a multilayer circuit board in which wiring is formed on the inner layer.
[0018] The substrate 110 has a first surface 111 and a second surface 112 opposite to each other, and the substrate 110 is provided with a cylindrical through hole 120 pe...
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A testing method for circuit board hole solder comprises the following steps: providing a to-be-tested circuit board, wherein the to-be-tested circuit board comprises at least one through hole, copper layers are plated on the hole wall and outer sides of hole openings of the through hole, and solder coating layers are respectively formed on the surfaces of the copper layers; measuring the resistance value between the solder coating layers outside the two openings of the through hole, and recording the resistance value as R1; soaking the to-be-tested circuit board in alkaline etching liquid, and then taking out and cleaning and drying the circuit board, wherein the alkaline etching liquid comprises the components, including ammonia water, ammonium chloride and copper chloride, and the range of PH of the alkaline etching liquid is between 7.8 and 9.0; then measuring the resistance value between the solder coating layers outside the two openings of the through hole again, and recording the resistance value as R2; and calculating the value of delta R via the formula that delta R=(R2-R1) / R1, and judging that the second solder coating layer has solder cracks or solder lacks in the hole if the value of delta R is greater than the set value.
Description
technical field [0001] The invention relates to a test method of a circuit board, in particular to a test method for solder defects such as solder cracks in holes or tin deficiency in holes of a circuit board after tin spraying. Background technique [0002] As a common surface coating form of circuit board surface treatment, HASL is widely used in the production of circuits. The quality of HASL will directly affect the quality of welding and solderability in subsequent customer production. Therefore, The quality of HASL has become a key point in the quality control of circuit board manufacturers. [0003] When spraying tin in the hole of a thicker circuit board, it is often difficult for the solder to enter the hole due to the high viscosity of the solder, so that the tin in the hole is poor, and tin deficiency occurs in some areas. In addition, due to stress and other reasons, the solder in the hole is also prone to defects such as solder cracks. Defects such as solder c...
Claims
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IPC IPC(8): G01N27/20
Inventor 白耀文
Owner QING DING PRECISION ELECTRONICS HUAIAN CO LTD