Silver palladium alloy monocrystal bonding wire and manufacturing method thereof

Abstract

The invention discloses a silver palladium alloy monocrystal bonding wire and a manufacturing method thereof. The materials forming the bonding wire are as follows, by weight, silver content is 99.9868%-99.9943%, palladium content is 0.003%-0.008%, copper content is 0.002%-0.004%, calcium content is 0.0001-0.0003%, and beryllium content is 0.0006%-0.0009%. The bonding wire has the advantages of being low in price, good in electrical properties, good in oxidation resistance properties, and stable and reliable in properties. The bonding wire can be used for bonding gold wires and gold-plating bonding copper wires in the fields of middle and low end light emitting diode (LED) package, semiconductor devices, and integrated circuit (IC) package in a replaced mode.

Description

technical field [0001] The invention relates to a metal bonding wire and a manufacturing method thereof for a microelectronic subsequent packaging process, in particular to a silver-palladium alloy single crystal bonding wire and a manufacturing method thereof. Background technique [0002] At present, the most widely used wire packaging bonding wire used in the fields of integrated circuits and semiconductor discrete devices is gold bonding wire. Because yellow metal is a precious metal, the price is expensive and rising day by day, which brings heavy cost pressure to the most used medium and low-end LED and IC packages. Therefore, the industry urgently needs new bonding wire materials with relatively low cost and stable and reliable performance to replace gold-based bonding wires. [0003] At present, most domestic research and application for replacing gold-based bonding wires focus on copper-based bonding wires, but this type of bonding wire also has its shortcomings: ①...

AI Technical Summary

Problems solved by technology

[0003] At present, most domestic research and application for replacing gold-based bonding wires focus on copper-based bonding wires, but this type of bonding wire also has its shortcomings: ① Copper wires are difficult to pull due to work hardening during the drawing process. The wire diameter is as thin as that of gold bonding wire; ②Because the copper wire is too hard, it will cause the first solder joint to easily escape the wire, so that the bonding operation is frequently interrupted, causing great difficulties to the integrated circuit packaging in the next process; ③Because copper wire is easy to oxidize, it is easy to oxidize during storage and welding. After opening the package, it must be used up as soon as possible, and nitrogen and hydrogen mixed gas must be added to protect it, which increases the risk of operation.