Self-heat-dissipation light emitting diode (LED) light source and manufacturing method

Abstract

The invention discloses a self-heat-dissipation light emitting diode (LED) light source and a manufacturing method. The self-heat-dissipation LED light source comprises a heat dissipation substrate, a positive and negative electrical lead, an LED light-emitting chip set and silicone fluorescent powder mixture, all LED light-emitting chips in the LED light-emitting chip set are in electrical connection, the positive and negative electrical lead is adhered on the heat dissipation substrate through silicon, and all LED light-emitting chips are fixed on the heat dissipation substrate through transparent silicon. Two ends of the LED light-emitting chip set are respectively connected with the positive and negative electrical lead, and the silicone fluorescent powder mixture conducts package on the LED light-emitting chip set. According to the self-heat-dissipation LED light source, a ceramic board or a ceramic tube is adhered on a silver plating copper piece, a novel LED light source which can conduct heat dissipation independently and packaged through a low-power LED chip is used, heat dissipation material of the self-heat-dissipation LED light source is alumina ceramic, the electrical lead is stamped through copper type sectional material, and cost is low. The self-heat-dissipation light source is simple in structure, raw material is mainly composed of the alumina ceramic, copper, silicon and the LED chips, physical properties of the raw material are stable, and cost is low.

Description

technical field [0001] The invention relates to a self-radiating LED light source and a manufacturing method. Background technique [0002] With the rapid development of production technology and the rapid improvement of the performance of light-emitting diodes, its application fields are expanding day by day. From the initial display field to today's lighting field, first it was decorative lighting, then outdoor lighting, and now it has begun to enter the field of indoor lighting and home lighting. The problems of luminous efficiency and luminous flux maintenance rate have been solved, and the current bottlenecks are the heat dissipation of LEDs, the stability of materials and cost performance. At present, the radiators used in LED lamps are made of metal materials, such as aluminum and copper, and they are also used to form ceramics. With the increase of the power of LED lamps, radiators made of these materials must increase the volume of the radiator in order to achieve...

AI Technical Summary

Problems solved by technology

From the initial display field to today's lighting field, first it was decorative lighting, then outdoor lighting, and now it has begun to enter the field of indoor lighting and home lighting. The problems of luminous efficiency and luminous flux maintenance rate have been solved. The current bottleneck is the heat dissipation problem of LEDs, the stability of materials and the cost performance.

At present, the radiators used in LED lamps are made of metal materials, such as aluminum and copper, and they are also used to form ceramics. With the increase of the power of LED lamps, radiators made of these materials must increase the volume of the radiator in order to achieve the cooling effect. The heat dissipation area, so the volume is large, the manufacturing process is complicated, and the cost is high; and the volume of the whole lamp is correspondingly large, the raw materials used increase and the cost is high; the connection part of this kind of radiator and the LED light source adopts heat dissipation silicone grease or silica gel sheet to dissipate heat. The heat dissipation silicon has a low thermal conductivity, generally 1~3W / m·K, which increases the overall thermal resistance

At present, the brackets of domestic LED light source packaging are formed by combining aluminum substrates (copper substrates) with high-temperature resistant plastics (or silicone bonding), such as imitation lumen brackets, patch brackets 3528, 5050, and integrated 30-100W brackets. Poor bonding between metal and plastic, plastic yellowing, easy to produce bubbles, color temperature consistency and high cost of silica gel

Foreign LED light source packaging generally adopts ceramic structure, its production process is complicated, the cost of ceramics is high, and the price is expensive, and it has patent protection

With the continuous improvement of LED light source power and brightness, the performance requirements of LED lighting products are also continuously improved, and the existing packaging structure and materials used can no longer meet the requirements.

The LED light source used in the existing LED lighting fixtures uses a 1W high-power LED chip, which has a large optical power, but also a large thermal power, and the heat per unit area is very concentrated, and the temperature junction of the chip is high, thus increasing the difficulty of heat dissipation design

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