Improved humidity sensor based on polyimide
A humidity sensor, polyimide technology, applied in the field of sensors, can solve the problems of long response time and limited contact area
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Embodiment 1
[0028] Example 1, see figure 1 :
[0029] (a) for preparing to make the silicon chip 1 of humidity sensor;
[0030] (b) make SiO for the front side of silicon wafer 1 described in (a) 2 Layer 2;
[0031] (c) for sputtering the metal seed layer and electroplating the capacitor electrode plate 3, typical electrode plate materials include Au etc.;
[0032] (d) for coating polyimide 4, make capacitor dielectric material;
[0033] (e) for making cavity 5 in polyimide, and curing;
[0034] The three-dimensional image of the fabricated humidity sensor is as follows: figure 2 shown.
Embodiment 2
[0036] The shape of the cavity is as image 3 As shown, single or multiple cavities are fabricated in the polyimide between the electrode plates along the direction of the electrode plates. The number of multiple cavities is 2 or more. Under the condition of meeting the requirements of lithographic precision, the more the number of cavities and the smaller the opening of the cavities, the better the performance of the sensor should be.
[0037] Except that the cavity manufacturing method is different from Embodiment 1, the rest of the steps and process parameters are completely the same as those in Embodiment 1.
Embodiment 3
[0039] The cavity as Figure 4 As shown, multiple cavities were fabricated in the polyimide between the electrode plates perpendicular to the direction of the electrode plates. The number of cavities is 2 or more. Under the condition of meeting the requirements of lithographic precision, the more the number of cavities and the smaller the opening of the cavities, the better the performance of the sensor should be.
[0040] Except that the manufacturing method of the cavity is different from that in the first embodiment, the rest of the steps and process parameters are completely the same as those in the first embodiment.
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