Manufacturing method of patterning metal lines

Abstract

The invention relates to the field of electronic manufacturing, and discloses a manufacturing method of patterning metal lines. A substrate is provided. Prepared active liquid and photoetching or printing technology are utilized to manufacture the surface of a patterning dopaminergic substrate on the substrate. Dopaminergic substances are added into the active liquid. The patterning substrate is arranged inside metal plating solution, and a layer of metal is deposited at the places on which the dopaminergic substances are exposed on of the surface of the substrate. A reducing agent is added in the metal plating solution. The patterning metal lines are patterning conductive films or fine circuit lines. If the patterning conductive film to be manufactured is a single-sided patterning conductive film, then in the step of manufacturing the surface of the patterning dopaminergic substrate, a resisting layer incapable of reacting with metal is coated on one face of the substrate, and the other face of the substrate is used for manufacturing the surface of the dopaminergic substrate, or the resisting layer is coated on the face which is not patterning of the substrate before the step of arranging the patterning substrate into the metal plating solution.

Description

technical field [0001] The invention relates to the field of electronic manufacturing, in particular to the preparation technology of patterned metal circuits. Background technique [0002] The preparation of metal lines on insulating substrates is a very important production link in the electronics / microelectronics industry. In recent years, with the development of microelectronics and semiconductor technology, people's requirements for metal lines are increasing day by day. The pursuit of low-cost manufacturing technology has greatly stimulated the enthusiasm of researchers to develop new metal circuit preparation technology. The traditional process is to etch away the metal not covered by the photoresist after photolithography to form the circuit. This "subtractive" process causes various problems such as metal waste, cost increase, and environmental pollution. With the gradual miniaturization of electronic devices In the direction of development, the traditional "subtra...

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Problems solved by technology

The stabilizer coated on the periphery of micro-nano materials usually needs to be decomposed and desorbed at a high temperature of 250°C. In order to obtain better conductivity, the current ink sintering temperature is high, which is not suitable for some cheap and low glass transition temperature. Polymer substrate, and reducing the sintering temperature will sacrifice the conductivity of the film due to the residue of the stabilizer

In addition, it is difficult to control the thickness of the film layer at a lower nanometer level by printing, and the conductive grid is a protrusion exposed on the surface of the substrate, which increases the surface roughness of the product, and the conductive circuit is adhered to the substrate after sintering. The attachment is not strong, and the conductivity is prone to drastic changes when bending

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