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Manufacturing method of high-interlayer bonding strength high-deflection thin paperboard

A technology combining strength and manufacturing method, applied in the field of papermaking, can solve the problems of easy moisture absorption of starch, reduced stiffness of cardboard, and incompletely suitable manufacturing of thin cardboard, etc. Significant effect of bonding strength and stiffness between

Active Publication Date: 2013-07-31
JIANGXI JIEMEI ELECTRONICS INFORMATION MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because some thin paperboards need both high-layer bonding strength and high stiffness, and when the starch content in the cardboard is high, because the starch has a hydrophilic group and is easy to absorb moisture, the softness and stiffness of the cardboard will be reduced. Therefore, this method is used for The manufacture of thin cardboard is not completely suitable, mainly because the starch retained in the cardboard is easy to absorb moisture and reduce the stiffness of the cardboard

Method used

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  • Manufacturing method of high-interlayer bonding strength high-deflection thin paperboard
  • Manufacturing method of high-interlayer bonding strength high-deflection thin paperboard

Examples

Experimental program
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Effect test

Embodiment 2）

[0018] The composite adhesive aqueous solution is an aqueous solution formed by successively dispersing and dissolving polyacrylamide modified products, modified melamine formaldehyde resin water repellent agent and starch in the same tank of clear water, and its mass concentration is 1.0%-3.5%, wherein polypropylene Amide modified product is 0.3%-1.0%, modified melamine formaldehyde resin water repellent concentration is 0.05%-0.20%, spray starch is 0.65%-2.3%; polyacrylamide modified product between two adjacent wet paper sheets Spray amount of stock solution 0.15g—0.50g / m 2 , The spraying amount of modified melamine formaldehyde resin anti-water agent stock solution is 0.025g—0.10g / m 2 , Spray starch spray amount 0.325g—1.15g / m 2 , The adhesive solution sprayed between the wet paper layers must be in the form of mist, and the sprayed mist adhesive solution covers the paper completely. (See Example 3).

Embodiment 1

[0019] Example 1: The main component of the adhesive is spray starch, the concentration of its aqueous solution is generally 1.0%-4.0%, and the amount of spray starch sprayed between two adjacent wet paper sheets is 0.53g-2.1g. The optimal concentration of spray starch depends on the speed of the paper machine and the amount of starch sprayed, and the preferred concentration is 2.5%-3.5%. Spray amount between starch layers 1.31--1.83g / m 2 .

Embodiment 2

[0020] Example 2: The main components of the composite adhesive are polyacrylamide modified product and modified melamine formaldehyde resin water repellent agent, the concentration of its aqueous solution is generally 0.35%-2.0%, and the polyacrylamide modified between two adjacent wet paper sheets The spraying amount of the raw material liquid of the agent is 0.15g-0.95g per square meter, and the spraying amount of the raw liquid of the modified melamine-formaldehyde resin water-resistant agent is 0.025g-0.10g per square meter. The optimal use concentration depends on the speed of the paper machine and the amount of spraying. The concentration of the stock solution of modified polyacrylamide is 1.2%, and the stock solution of modified melamine formaldehyde resin is 0.12%. Spray amount between layers: stock solution of modified polyacrylamide 0.57 g / m 2 , modified melamine formaldehyde resin water repellent stock solution 0.057 g / m 2 .

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Abstract

The invention discloses a manufacturing method of a high-interlayer bonding strength high-deflection thin paperboard. The manufacturing method is characterized in that a compound binder aqueous solution is sprayed between two adjacent wet paper sheets so that the high-interlayer bonding strength high-deflection thin paperboard is formed; the compound binder aqueous solution is prepared by orderly dissolving a polyacrylamide modifier and a modified melamino-formaldehyde resin water repellent agent in clear water in a tank to form an aqueous solution; a mass concentration of the aqueous solution is in a range of 0.35 to 2.0%; the aqueous solution comprises 0.3 to 1.8wt% of the polyacrylamide modifier and 0.05 to 0.20wt% of the modified melamino-formaldehyde resin water repellent agent; a spray amount of the polyacrylamide modifier stoste between the two adjacent wet paper sheets is in a range of 0.15 to 0.95g / m<2>; a spray amount of the modified melamino-formaldehyde resin water repellent agent stoste is in a range of 0.025 to 0.10g / m<2>; the compound binder aqueous solution sprayed between the two adjacent wet paper sheets is in a mist state; and the sprayed compound binder aqueous solution mist is covered on the whole wet paper sheets. The manufacturing method increases bonding points and bonding force between paper pulp fibers, and improves interlayer bonding strength, deflection and moisture resistance of the paperboard.

Description

technical field [0001] The invention belongs to the technical field of papermaking, and relates to a method for manufacturing thin cardboard with high interlayer bonding strength and high stiffness. Background technique [0002] Some special thin cardboard especially 250g / m 2 —600g / m 2 All thin paperboards are required to have high interlayer bonding strength and high stiffness, and there should be no delamination and deformation of finished products due to poor stiffness during use. Generally, increasing the beating degree of pulp is used to increase the bonding strength between layers of cardboard, but on the one hand, pulp with a high beating degree is difficult to filter water in the papermaking wire, and the dehydration of the formed wet paper is poor. Wrinkles and other paper defects, on the other hand, the produced cardboard has high tightness and poor stiffness, and it needs to consume more electric energy to improve the beating degree. Small, relatively high stif...

Claims

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Application Information

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IPC IPC(8): D21H27/36B32B37/12C09J103/02C09J133/26C09J161/28
Inventor 姜兆宏姜楠
Owner JIANGXI JIEMEI ELECTRONICS INFORMATION MATERIAL CO LTD
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