Electroplating solution and application thereof

A technology of electroplating solution and solute, applied in the direction of electrolytic paint, coating, etc., can solve the problems of uneven thickness of metal coating and easy falling off of diamond, and achieve the effect of improving cutting efficiency and cutting ability, reducing coating thickness and uniform coating

Active Publication Date: 2013-08-07
JIANGSU XIEXIN SOFT CONTROL EQUIP TECH DEV
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Problems solved by technology

[0004] Based on this, it is necessary to provide an electroplating solution and its application to solve the problems of t

Method used

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  • Electroplating solution and application thereof
  • Electroplating solution and application thereof
  • Electroplating solution and application thereof

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Embodiment Construction

[0062] The electroplating solution and its application will be described in further detail below mainly in conjunction with specific examples.

[0063] The electroplating solution of one embodiment of the present invention is mainly used in the diamond saw band electroplating process, and its solvent is water, and solute and solute concentration are as follows:

[0064] Nickel Sulfate (NiSO 4 ) 160~220g / L;

[0065] Nickel Chloride (NiCl 2 ) 30~60g / L;

[0066] Cobalt Sulfate (CoSO 4 ) 60~120g / L;

[0067] boric acid (H 3 BO 3 ) 30~60g / L;

[0068] p-toluenesulfonamide (PTSA) 0.3~0.8g / L;

[0069] Sodium dodecylsulfonate (SDS) 2~6g / L;

[0070]1,4 butynediol (MSDS) 0.5~1.5g / L; and

[0071] Sodium allyl sulfonate (the structural formula is CH 2 =CH-CH 2 -SO 3 Na)

[0072] 0.2~0.8g / L.

[0073] Further, in a preferred embodiment, each solute and concentration of the electroplating solution are respectively:

[0074] Nickel sulfate 160g / L; ...

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Abstract

The invention relates to an electroplating solution. The solute comprises 160-220 g/L nickel sulfate, 30-60 g/L nickel chloride, 60-120 g/L cobaltous sulfate, 30-60 g/L boric acid, 0.3-0.8 g/L para toluene sulfonamide, 0.5-1.5 g/L 1,4-butynediol and 0.2-0.8 g/L sodium alkyl sulfonate. The solvent is water. The diamond saw band prepared by the electroplating solution has the advantages of uniform coating, high coating hardness, great force for holding diamond, great effective cutting surface, and obviously higher cutting efficiency and cutting power. Under the conditions of the same holding force, the coating thickness of the prepared diamond saw band is obviously lowered, thereby lowering the production cost of the diamond saw band, increasing the void ratio, being beneficial to discharge of cutting powder, and enhancing the cutting efficiency. Besides, the invention also relates to application of the electroplating solution.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating solution used in the diamond saw band electroplating process and its application. Background technique [0002] Solar photovoltaic power generation is one of the rapidly developing forms of sustainable energy utilization. In recent years, it has developed rapidly in the United States, the European Union, Japan and China. At present, the most widely used photovoltaic power generation is crystalline silicon solar cells. Reducing the cost of solar power generation has always been the development goal of the photovoltaic industry. The cutting of silicon ingot should be cut with diamond saw band. The cutting life of the diamond saw band directly affects the cost of the stage. [0003] The traditional nickel plating method fixes the diamond particles on the surface of the stainless steel strip to form a saw band. However, due to the low hardness of nickel, ...

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Application Information

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IPC IPC(8): C25D3/56C25D15/00
Inventor 黄修康薛抗美陈湘伟马俊杰
Owner JIANGSU XIEXIN SOFT CONTROL EQUIP TECH DEV
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