Primer for metal substrate structural bonding and preparation method thereof

A technology for metal substrates and structural adhesives, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of narrow applicability, short storage period, etc., and achieve enhanced adhesion, stable performance, and easy coating Effect

Inactive Publication Date: 2013-08-14
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problems of narrow applicability and short storage period of the primer used for structural bonding of metal substrates, and provides a primer for structural bonding of metal substrates and a preparation method thereof

Method used

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  • Primer for metal substrate structural bonding and preparation method thereof
  • Primer for metal substrate structural bonding and preparation method thereof
  • Primer for metal substrate structural bonding and preparation method thereof

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specific Embodiment approach 1

[0012] Specific implementation mode 1: In this embodiment, a primer for structural bonding of metal substrates is characterized in that the primer for structural bonding of metal substrates is composed of 5.6 to 24.7 parts of epoxy resin system, 1.5 to 24.7 parts by mass. 4.1 parts of curing system and 68.4 to 92.3 parts of solvent system; wherein the epoxy resin system is composed of epoxy resin, toughener and diluent in a mass ratio of (8~12.5):(2~5):1 ; The curing system is composed of an amine curing agent and a curing accelerator in a mass ratio (6-12): 1.

[0013] The primer for metal substrate structure bonding in this embodiment can be used for epoxy resin-based system adhesive films cured at 110°C to 180°C, without affecting the adhesive performance of the adhesive film. The storage period at room temperature is 20 days, and it can be stored at -18°C. There is no change in performance for 12 months. Brush or spray the metal base material structure adhesive primer of t...

specific Embodiment approach 2

[0014] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the epoxy resin is one or both of bisphenol A type epoxy resin, bisphenol F type epoxy resin and novolak epoxy resin than the composition of the mixture. Others are the same as the first embodiment.

specific Embodiment approach 3

[0015] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the toughening agent is carboxyl-terminated liquid nitrile rubber, polysulfide rubber, liquid silicone rubber, polyether, polysulfone, polyethersulfone and polyamide A mixture of one or more imines in any ratio. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention relates to a primer for metal substrate structural bonding and a preparation method thereof. The invention aims to solve the problems of narrow technical applicability and short storage period in the existing primer for metal substrate structural bonding. The primer for metal substrate structural bonding is prepared from the following components in parts by mass: 5.6-24.7 parts of epoxy resin system, 1.5-4.1 parts of curing system and 68.4-92.3 parts of solvent system. The preparation method comprises the following steps: 1. preparing the epoxy resin system; 2. preparing the curing system; and 3. weighing 5.6-24.7 parts of epoxy resin system, 1.5-4.1 parts of curing system and 68.4-92.3 parts of solvent system, putting in a stirring unit, and sufficiently stirring until no precipitate exists to obtain the primer for metal substrate structural bonding. The invention is applicable to the field of preparation of primers for metal substrate structural bonding.

Description

technical field [0001] The invention relates to a primer for metal base material structural bonding and a preparation method thereof. Background technique [0002] The surface treatment of the metal substrate is a necessary condition for obtaining the best bond strength for the structural bonding of the metal substrate. After the treatment, the surface of the metal substrate will no longer have grease, dust and oxide layer. In order to avoid secondary pollution on the surface of the treated metal substrate affecting the bonding performance, it is generally required to bond the metal substrate within 8 hours after treatment, which limits the convenience of use. In this case, the primer for structural bonding of metal substrates plays an active role. Spraying or brushing the primer on the surface of the treated metal substrate can prolong the storage time of the treated metal surface and It plays an anti-corrosion role in the use of metal structural parts. In addition, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/04C09J11/06C09J7/02
Inventor 高堂铃付刚何影翠王冠匡弘付春明
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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