Wafer level packaging method and structure of image sensor

An image sensor and wafer-level packaging technology, applied in radiation control devices, etc., can solve problems such as poor reliability of T-shaped connections, device radiation damage, large capacitance value, etc., and achieve low cost, no radiation damage, and high packaging reliability effect

Inactive Publication Date: 2013-08-14
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a wafer-level packaging method for an image sensor and its structure, which are

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  • Wafer level packaging method and structure of image sensor
  • Wafer level packaging method and structure of image sensor
  • Wafer level packaging method and structure of image sensor

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Embodiment Construction

[0059] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0060] see Figure 2 to Figure 11 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed ar...

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Abstract

The invention relates to a wafer level packaging method and structure of an image sensor. The method comprises the following steps: an image sensor wafer (1) consisting of a plurality of chips is provided and bonded with a transparent substrate (5); back thinning is performed to the image sensor wafer (1); the punching is carried out at positions, corresponding to a bonding pad electrode (4), on the back of the image sensor wafer to form a plurality of first through holes; an insulation layers (8) is coated and solidified; inverted trapezoidal second through holes are further formed in the insulation layers in the first through holes to expose the bonding pad electrode (4), wherein the first through holes and the second through holes are coaxial; a metal seeding layer (10) is sputtered and a metal interconnection layer (11) is formed through electroplating sequentially; and a second passivation layer (12) and a solder ball bump (13) are prepared sequentially. According to the invention, the whole technological process is completed on wafer level, the interconnection density is relatively high on the basis of reducing the packaging cost, and meanwhile, the interconnection structure prepared has higher reliability.

Description

technical field [0001] The invention relates to a through-silicon via (TSV) wafer-level packaging process of an image sensor. The invention belongs to the field of image sensor package manufacturing. Background technique [0002] Generally speaking, an image sensor is a semiconductor module used to convert an optical image into an electronic signal, store the image signal and transmit it to a display device. [0003] With the development of information technology, image sensing modules are more and more widely used in digital mobile products, especially cellular phones, and its market has also maintained growth for many years. However, with the trend of miniaturization and multi-function in the semiconductor industry and continuous competition in the market, the new generation of mobile products has higher requirements for image sensing modules, such as small form factor and low cost. Traditional image sensor module packages, such as Chip On Board (COB) and Chip On Flexibl...

Claims

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Application Information

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IPC IPC(8): H01L27/146
Inventor 叶交托罗乐徐高卫王双福
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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