Stack type baseplate structure

A stacked, substrate technology, applied in the direction of printed circuits, electrical components, sealed enclosures, etc. where non-printed electrical components are connected, it can solve the problems of non-compliance with economic costs, difficult process control, etc., to reduce circuit short circuit or abnormality , The effect of improving production efficiency and simplifying process steps
CN103249273AActive Publication Date: 2013-08-14UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO LTD +1
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO LTD
Publication Date
2013-08-14

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Abstract

The invention provides a stack type baseplate structure. The stack type baseplate structure comprises a baseplate unit, a first frame body, an electric conductor unit and a blocking body unit, wherein the baseplate unit comprises a first baseplate and a second baseplate; the first frame body is arranged between the first baseplate and the second baseplate; the electric conductor unit comprises a plurality of first electric conductors and a plurality of second electric conductors; the first electric conductors are respectively connected with the first baseplate and the first frame body through soldering tin; the second electric conductors are respectively connected with the second baseplate and the first frame body through soldering tin; and the first electric conductors are electrically connected with the second electric conductors. The blocking unit comprises a first blocking body and a second blocking body, the first blocking body surrounds the first electric conductors, the second blocking body surrounds the second electric conductors, the first blocking body is closely fitted between the first baseplate and the first frame body through soldering tin, and the second blocking body is closely fitted between the second baseplate and the first frame body through soldering tin.
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Description

technical field

[0001] The invention relates to a substrate structure, in particular to a stacked substrate structure for printed circuit boards. Background technique

[0002] With the rapid development of electronic consumer products, various electronic products according to the different needs of consumers are also constantly being introduced. In order to make general electronic products more powerful and further attract consumers' desire to buy, electronic products will gradually develop towards thinner, thinner and smaller, so the printed circuit boards used will also tend to high-density design layout, stacked multi-layer structure, and miniaturized size. , Continuously increasing functions and thin plate design. Therefore, how to fully consider the goodness of the electrical connection during the design process of the printed circuit board, and to ensure the integrity of the signal, without circuit abnormality or poor signal transmission, has become the focus of the c...

Claims

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