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A kind of LED encapsulation substrate and method for conformal coating

A technology of LED packaging and conformal coating, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of complex conformal coating, high cost, and inability to realize conformal coating of LED horizontal chips, and achieve good reliability. Operability, improved packaging performance, good and rapid wide application effect

Active Publication Date: 2015-11-18
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the electrophoresis method and solution evaporation method are more complex and costly to achieve conformal coating; the process methods of wafer level packaging and pulse spraying have higher requirements on packaging equipment, the process must be precisely controlled, and the conformal coating of LED horizontal chips cannot be achieved. coating

Method used

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  • A kind of LED encapsulation substrate and method for conformal coating
  • A kind of LED encapsulation substrate and method for conformal coating
  • A kind of LED encapsulation substrate and method for conformal coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] see figure 1 , is a lead frame structure 1001 for LED packaging including a boss 1010 structure, and the boss 1010 is a rectangular structure. Such as figure 2As shown, after the LED chip 1005 is bonded on the center of the top surface of the boss 1010, after the gold wire 1004 wire bonding process is completed, the concentration is 0.5g / cm 3 Phosphor glue 1007 is dispensed on the top surface of lead frame boss 1010 by phosphor dispensing device 1009 , the volume of phosphor glue is 0.2 μL, and it can cover LED chip 1005 . After coating the phosphor glue, the LED module was placed in a chamber at 45°C for 1 hour to achieve the precipitation of the phosphor particles. Such as image 3 It means that after the phosphor powder is precipitated, the phosphor powder particles are tightly distributed around the chip, and the upper layer is pure silica gel. The LED module that has completed the above process is transferred to a baking oven at a temperature of 150° C. for 1 ...

Embodiment 2

[0034] see Figure 4 , a ceramic substrate 2001 for LED packaging with a boss structure, and the boss 2004 is a circular structure. Such as Figure 5 As shown, after the LED chip 1005 is bonded to the center of the top surface of the boss 1010, and the wire bonding process of the gold wire 1004 is completed, the concentration of the matching phosphor is 0.8g / cm 3 Phosphor glue 1007, wherein the phosphor glue contains diluent ethanol 1.8%, and the concentration of PMMA particles is 0.1g / cm 3 ,; Dispensing the phosphor powder glue on the top surface of the boss 2004 through the phosphor powder dispensing device 1009, with a volume of 0.16 μl, and can cover the LED chip 1005. Such as Image 6 It means that after the phosphor powder is precipitated, the phosphor powder particles are tightly distributed around the chip, and the upper layer is pure silica gel. After coating the phosphor glue, the LED module was placed in a cavity at 55°C for 1 hour, the ethanol began to volatili...

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Abstract

The invention discloses an LED packaging substrate and a method for coating in a shape-preserving mode. The surface of the substrate is a light reflecting layer, a boss is arranged at the position where a chip is fixed on the substrate, the upper surface of the boss is provided with a groove which is used for being aligned to the substrate when crystals of an LED chip are fixed in LED packaging, a zone, except the position where the crystals are fixed on the chip, on the boss is coated with a chemical coating layer with pro-fluorescent powder glue so that the fluorescent powder glue can be spread out on the boss quickly. The method includes the steps: the fluorescent powder glue is coated along the center of the boss of the substrate and the fluorescent powder glue is reserved on the upper top face of the boss; the fluorescent powder glue is put into an environment with temperature higher than the room temperature and lower than the solidification temperature to enable organic solvent to be evaporated; at the same time, due to the fact that viscosity of the fluorescent powder glue becomes low, fluorescent powder particles are subsided on the fluorescent powder glue quickly till the fluorescent powder particles are distributed around the chip to form a thin fluorescent powder layer. Therefore, the coating of the fluorescent powder in the shape-preserving mode is achieved. The coating of the fluorescent powder in the shape-preserving mode can be compatible with a device with a fluorescent powder free glue dispensing coating technology. The LED packaging substrate and the method for coating in the shape-preserving mode have the advantage of being simple in technology.

Description

technical field [0001] The invention belongs to LED packaging technology, relates to an LED packaging substrate and a method for conformal coating, which can realize conformal coating of LED phosphors with high light color quality and color temperature stability, and is especially suitable for large-scale LED packaging production middle. Background technique [0002] LEDs (Light Emitting Diodes) are semiconductor light-emitting devices based on the principle of P-N junction electroluminescence. They have the advantages of high electro-optical conversion efficiency, long service life, environmental protection and energy saving, and small size. The application in the field of traditional lighting will result in a very significant energy-saving effect, which is of great significance in today's increasingly tense global energy sources. With the breakthrough of the third-generation semiconductor material technology represented by nitrides, the semiconductor lighting industry bas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50
Inventor 罗小兵郑怀王依蔓李岚
Owner HUAZHONG UNIV OF SCI & TECH