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Method for assisting TLP (transient liquid phase) diffuse bonding of dual-layer plate structure of aluminum matrix composite employing pulse current

An aluminum-based composite material and pulse current technology, which is applied in the field of pulse current-assisted TLP diffusion connection of aluminum-based composite two-layer plate structure, can solve problems affecting the joint connection quality, improve mechanical properties, and increase energy utilization. Effect

Inactive Publication Date: 2013-08-28
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the technical problem that the oxide film existing on the surface of the aluminum-based composite material affects the connection quality of the joint, and provides a method for the pulse current-assisted TLP diffusion connection of the two-layer plate structure of the aluminum-based composite material

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  • Method for assisting TLP (transient liquid phase) diffuse bonding of dual-layer plate structure of aluminum matrix composite employing pulse current
  • Method for assisting TLP (transient liquid phase) diffuse bonding of dual-layer plate structure of aluminum matrix composite employing pulse current

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specific Embodiment approach 1

[0019] Specific implementation mode 1: In this implementation mode, the pulse current-assisted TLP diffusion connection method of the two-layer plate structure of aluminum matrix composite material is as follows:

[0020] 1. Homogenize and mechanically mix the intermediate layer powder, and add ethanol to make a uniform paste to obtain the intermediate layer material;

[0021] 2. Use 800# sandpaper to polish the surface of the aluminum matrix composite material to be connected to remove the scale, and use acetone to clean it;

[0022] 3. Spread the intermediate layer material on the surface of the aluminum-based composite material to be connected after step 2 to obtain a sample, apply a pressure of 0.5MPa to connect the intermediate layer material to the graphite electrode, and evacuate to a vacuum degree of 1×10 -3 Pa, and then pass in the pulse current, the voltage is 1V ~ 5V, the current is 1×10 -2 A / mm 2 ~3×10 -2 A / mm 2 Under the condition of energizing for 15-50 minut...

specific Embodiment approach 2

[0025] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the intermediate layer powder described in step 1 is a mixture of Al powder, Cu powder, and Ti powder, and the mass percentage of Al powder in the mixture is 45-55% %, the mass percentage of Cu powder is 20-30%, and the mass percentage of Ti powder is 20-30%. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0026] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the intermediate layer powder described in step one is a mixture of Al powder, Cu powder and Ti powder, wherein Al powder, Cu powder and Ti powder The mass ratio is 2:1:1. Others are different from the first or second specific embodiment.

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Abstract

The invention discloses a method for assisting TLP (transient liquid phase) diffuse bonding of a dual-layer plate structure of aluminum matrix composite employing pulse current, and relates to a bonding method of the dual-layer plate structure, which solves the technical problems that an oxidation film on the surface of the aluminum matrix composite affects the bonding quality of joints. The method comprises the steps of: 1, carrying out homogeneous mechanical mixing on powder on a middle layer, and adding ethanol to obtain a middle layer material; and 2, spreading the middle layer material on the surface to be bonded of the aluminum matrix composite processed in step 2 to obtain a sample, bonding the middle layer material and a graphite electrode, and cooling along with the furnace under a vacuum condition, so as to finish bonding of the aluminum matrix composite. Aluminum-copper eutectic reaction temperature is low, so that the aluminum matrix composite can be bonded at the temperature which is lower than hard-solder temperature; the obtained joint is good in tissue and performance under the condition of not exerting pressure or just exerting small pressure; and the oxidation film on the surface of the aluminum matrix composite can be punctured by high-temperature plasma generated by the pulse current, and electrical breakdown.

Description

technical field [0001] The invention relates to a connection method of a two-layer board structure. Background technique [0002] Particle-reinforced aluminum-based composites have high specific strength, specific stiffness, wear resistance, and corrosion resistance. Their properties are isotropic, and they have both structural and functional materials. s concern. The two-layer structure has been widely used in aerospace and other fields. It can improve the structural load-bearing efficiency and reduce the weight of structural parts, and has achieved significant technical and economic benefits for the development of modern industry. With the development of aviation, aerospace, space technology and microelectronics technology, there is a solid oxide film on the surface of aluminum-based composite materials on some key components, which seriously affects the connection quality of joints. It is difficult to use common connection methods. The ideal effect is achieved, which af...

Claims

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Application Information

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IPC IPC(8): C22C1/04
Inventor 张凯锋王博赖小明王哲
Owner HARBIN INST OF TECH