Diamond cutter array grinding tool device and processing method thereof
A technology of diamond knives and diamond particles, used in grinding devices, metal processing equipment, abrasives, etc., can solve the problems of abrasive grain embedding, slump, affecting material properties, etc., and achieve the effect of high-efficiency plastic domain processing
Active Publication Date: 2013-09-11
河南创研新材料科技有限公司
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Problems solved by technology
[0003] In order to overcome defects such as embedding of abrasive grains and edge sagging that are prone to occur when traditional ultra-precision machining devices process soft and brittle materials, which seriously affect the performance of materials, the present invention provides a low-cost, high-efficiency, precise, and less-damaged soft and brittle material. An ultra-precision machining method for brittle materials, which uses a new type of ultra-precision grinding tool - diamond knife array grinding tool
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[0035] refer to Figure 1 to Figure 4 , a diamond knife array grinding tool device, comprising a disc body 1, a cutter bar 2, diamond particles 3 and an air cavity 4, the disc body 1 is a circular structure, and the disc body 1 is provided with the center of the disc body 1 as The multi-layer annular arrangement in the center is equipped with the air cavity hole of the cutter bar 2 of equal diameter and the air cavity 4 communicating with the compressed air 6; the cutter bar 2 is arranged and installed in the air cavity hole, and the The front end of the cutter bar 2 is brazed with the diamond particles 3, the tail end of the cutter bar 2 is installed in the air cavity hole and communicates with the air cavity 4 to form a piston end, and the piston ends of each cutter bar pass through The air cavity 4 communicates; the compressed air applies normal air pressure to the piston end of the cutter bar so that the cutting edge of the diamond particles forms a multi-directional micro...
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The invention discloses a diamond cutter array grinding tool device and a processing method thereof. The device comprises a disk body, cutter rods, diamond particles and an air cavity, the disk body is of a round structure, multiple layers of annularly-distributed air cavity holes provided with the cutter rods identical in diameter and the air cavity communicated with compressor air are formed in the disk body, the cutter rods are mounted in the air cavity holes, the diamond particles are brazed at the front ends of the cutter rods, the tail ends of the cutter rods are mounted in the air cavity holes and communicated with the air cavity to form piston ends, the piston ends of the cutter rods are communicated through the air cavity, and normal air pressure is applied to the piston ends of the cutter rods through the compressed air to enable cutting edges of the diamond particles to perform multidirectional and microscale equal-cutting-depth cutting on workpieces. A diamond cutter array grinding tool is adopted, and each diamond particle on the grinding tool performs equal-cutting-depth processing on the workpieces, so that ultrathin cutting processing can be realized and processed surfaces are high in quality.
Description
technical field [0001] The invention relates to a diamond knife array grinding tool device and a processing method thereof. Background technique [0002] With the development of modern science and technology, soft and brittle materials have been widely used in many fields of modern high-tech industries, such as cadmium zinc telluride crystals used in room temperature nuclear radiation detector materials and high-performance infrared focal plane device (HgCdTe) substrate materials (CdZnTe, CZT), the only KDP crystal that can be used as a nonlinear optical material for inertial confinement nuclear fusion, wide bandgap, high carrier mobility semiconductor electronic materials GaAs, InP, optical glass FCD1, E-FSD1, etc. The application of these soft and brittle materials with excellent properties is becoming a research hotspot in the field of high-tech in the world. Soft and brittle materials are a relative concept. Compared with other brittle materials (the Mohs hardness of si...
Claims
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IPC IPC(8): B24D7/18B24D18/00
Inventor 吕迅李志鑫应申舜
Owner 河南创研新材料科技有限公司