Diamond knife array grinding tool device and processing method thereof

Abstract

The invention discloses a diamond cutter array grinding tool device and a processing method thereof. The device comprises a disk body, cutter rods, diamond particles and an air cavity, the disk body is of a round structure, multiple layers of annularly-distributed air cavity holes provided with the cutter rods identical in diameter and the air cavity communicated with compressor air are formed in the disk body, the cutter rods are mounted in the air cavity holes, the diamond particles are brazed at the front ends of the cutter rods, the tail ends of the cutter rods are mounted in the air cavity holes and communicated with the air cavity to form piston ends, the piston ends of the cutter rods are communicated through the air cavity, and normal air pressure is applied to the piston ends of the cutter rods through the compressed air to enable cutting edges of the diamond particles to perform multidirectional and microscale equal-cutting-depth cutting on workpieces. A diamond cutter array grinding tool is adopted, and each diamond particle on the grinding tool performs equal-cutting-depth processing on the workpieces, so that ultrathin cutting processing can be realized and processed surfaces are high in quality.

Description

Technical field [0001] The invention relates to a diamond knife array abrasive tool device and a processing method thereof. Background technique [0002] With the development of modern science and technology, soft and brittle materials have been widely used in many fields of modern high-tech industries, such as cadmium zinc telluride crystals used in room temperature nuclear radiation detector materials and high-performance infrared focal plane (HgCdTe) substrate materials (CdZnTe, CZT), the only non-linear optical material KDP crystal that can be used for inertial confinement nuclear fusion, wide band gap, high carrier mobility semiconductor electronic materials GaAs, InP, optical glass FCD1, E-FSD1, etc. The application of these excellent soft and brittle materials is becoming a research hotspot in the high-tech field in the world. Soft and brittle materials are a relative concept. Compared with other brittle materials (Silicon’s Mohs hardness is 7), for example, the Mohs hard...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome defects such as embedding of abrasive grains and edge sagging that are prone to occur when traditional ultra-precision machining devices process soft and brittle materials, which seriously affect the performance of materials, the present invention provides a low-cost, high-efficiency, precise, and less-damaged soft and brittle material. An ultra-precision machining method for brittle materials, which uses a new type of ultra-precision grinding tool - diamond knife array grinding tool

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