Unlock instant, AI-driven research and patent intelligence for your innovation.
A kind of biodegradable flexible conductive substrate and preparation method thereof
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A flexible conductive, rigid substrate technology, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve environmental and biological hazards, expensive, fragile and other problems, to reduce solid pollution, simple preparation process , good flexibility
Inactive Publication Date: 2015-12-23
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF3 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
In addition to being expensive, quartz substrates and silicon substrates have the same disadvantages as glass substrates, such as fragile, relatively heavy, inconvenient to carry, and non-degradable; although plastic substrates have the advantages of flexibility and light weight, most of them are non-degradable Or it is toxic and will cause great harm to the environment and organisms, which greatly limits the application range of the device
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0031] like figure 1 As shown, the biodegradable flexible substrate 1 of the substrate is silk fibroin, the conductive layer 2 is carbon nanotubes, and the thickness of the conductive layer is 200 nm. The entire device structure is described as:
[0034] ①Use acetone, ethanol solution and deionized water to ultrasonically clean the surface of the glass substrate whose surface roughness is less than 1nm, and dry it with dry nitrogen after cleaning.
[0035] ② Prepare the conductive layer of carbon nanotubes by spin-coating, the spin-coating speed is 1000 rpm, the duration is 30s, the film thickness is 200nm, and then the substrate is thermally annealed at 130°C;
[0036] ③Drop-coat the silk fibroin solution with a concentration of 10wt% on the glass substrate, heat the substrate to 60°C, and dry the solution.
[0037] ④ Peel off the dried biodegradable flexible conductive substrate from th...
Embodiment 2
[0040]Such as figure 1 As shown, the substrate is a biodegradable flexible substrate 1 viral cellulose, the conductive layer is silver nanowires, and the thickness of the conductive layer is 180nm. The entire device structure is described as:
[0042] The preparation process is similar to Example 1.
Embodiment 3
[0044] Such as figure 1 As shown, the biodegradable flexible substrate 1 of the substrate is gelatin, the conductive layer 2 is gold nanowires, and the thickness of the conductive layer is 160 nm. The entire device structure is described as:
[0046] The preparation process is similar to Example 1.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Property
Measurement
Unit
thickness
aaaaa
aaaaa
thickness
aaaaa
aaaaa
surface roughness
aaaaa
aaaaa
Login to View More
Abstract
The invention discloses a biodegradable flexible conductive substrate and a preparation method thereof. The substrate includes a biodegradable flexible substrate and a conductive layer, the flexible substrate material is a biodegradable material, and the conductive layer is attached to the surface of the biodegradable flexible substrate. Such substrates have both electrical conductivity and biodegradability, and can be widely used in the preparation of flexible optoelectronic / electronic devices, expanding the application range of optoelectronic / electronic devices, and reducing environmental pollution caused by electronic waste.
Description
technical field [0001] The invention relates to the fields of organic optoelectronic / electronic technology, biology and environmental science, in particular to a biodegradable flexible conductive substrate and a preparation method thereof. Background technique [0002] Organic optoelectronics / electronics technology is a rapidly developing industry with high technological content after microelectronics technology. With the rapid development of organic optoelectronic / electronic technology, optoelectronic / electronic products such as organic solar cells, sensors, and thin film transistors have gradually matured, and they have greatly improved people's lives. At the same time, the wide application of optoelectronic / electronic technology in various fields of social life has also created a huge growing market. However, with the increasing development of technology, many problems have also been brought. Firstly, conventional rigid substrates used in optoelectronic / electronic devic...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More