Metal sheet micro-deep drawing automation device and method used under indirect laser shock

Abstract

The invention discloses a metal sheet micro-deep drawing automation device and method used under indirect laser shock. The metal sheet micro-deep drawing automation device comprises a laser generation system, an automatic forming system and a control system. The laser generation system consists of a laser controller, a laser transmitter and an optical fiber. The automatic forming device consists of an end cover, a focusing lens cone, a machine body, a micro-deep drawing working table, a three-dimensional moving chuck, a base, a magnetic field changing device, a turntable multi-station device, a restraint layer-flyer integrated sheet, a restraint layer-flyer integrated sheet storage bin and a recovering device. The metal sheet micro-deep drawing automation device adopts pulse laser as a forming power source, performs energy conversion of optical energy and mechanical energy through the restraint layer-flyer integrated sheet and achieves automation of a micro-deep drawing process for a pulse laser driven flyer loading sheet. The automatic forming system is independent, the machining precision is not interfered by the outside, and personal errors are avoided. A laser path and the micro-deep drawing working table are stored in the machine body, and the safety of experiment operation is improved.

Description

technical field [0001] The invention relates to an automatic device for micro-deep drawing of a thin metal plate under indirect laser impact and a method thereof, belonging to the field of advanced forming of mechanical manufacturing and the field of automatic processing, especially the technical field of micro-electromechanical system (MEMS) parts processing. Background technique [0002] With the rapid development of modern science and technology, and with the continuous improvement of market requirements for technological products, in fields such as aerospace, precision instruments, and biomedicine, the application of micro-devices is becoming more and more extensive, and the demand for micro-components of various materials are increasing, thus promoting a new exploration of the processing technology of micro devices. [0003] Today's MEMS-oriented micromachining technology and technology are developed on the basis of integrated circuits, mainly relying on LIGA, etching, ...

AI Technical Summary

Problems solved by technology

However, the current device using laser-driven flyer micro-forming technology cannot continuously pulse laser-driven flyer micro-forming, and its mass production is only the forming of multiple dies under one pulse impact, which is not a rapid and continuous mass production in the true sense. Production, and because the workpiece and fixtures need to be re-clamped after a laser shock forming in this device and method, it is bound to bring human errors due to manual operations and affect the processing accuracy

Moreover, the open laser light path also has certain potential safety hazards

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