Ultrathin foam conductive adhesive tape
A conductive tape, ultra-thin technology, applied in the direction of conductive adhesives, film/sheet adhesives, adhesives, etc., can solve the problem of non-adhesive foam products such as cost
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[0049] (Meth)acrylate monomers useful for preparing (meth)acrylate pressure sensitive adhesive copolymers according to the present invention can be monomeric (meth)acrylate esters of non-tertiary alcohols containing 1 to 18 carbon atoms And preferably an average of 4 to 12 carbon atoms.
[0050] Examples of monomers suitable for use as (meth)acrylate monomers include esters of acrylic or methacrylic acid with non-tertiary alcohols such as ethanol, 1-propanol, 2-propanol, 1-butanol , 2-butanol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, 3-methyl-1-butanol, 1-hexanol, 2-hexanol , 2-methyl-1-pentanol, 3-methyl-1-pentanol, 2-ethyl-1-butanol, 3,5,5-trimethyl-1-hexanol, 3-heptanol , 1-octanol, 2-octanol, isooctyl alcohol, 2-ethyl-1-hexanol, 1-decanol, 2-propylheptanol, 1-dodecanol, 1-tridecanol , 1-tetradecyl alcohol, etc. Although combinations of two or more different (meth)acrylate monomers are suitable, in some embodiments the preferred (meth)acrylate monomer is (...
Embodiment 7~8
[0107] According to the following table 5, examples 7-8 were obtained according to the preparation process of examples 1-6, the slurry polymer used was S2, the formula did not contain tackifying resin, and the conductive particles were nickel powder-A (Ni-A), Polymer core-shell particles are selected from FN-80SDE. The thickness of the obtained adhesive tape is controlled at 0.10-0.12mm. The performance test results of the embodiments are shown in Tables 6-7.
[0108] The formula composition of table 5. embodiment 7~8 (by weight)
[0109]
[0110] Table 6. Peel Adhesion of Examples 7-8 (unit: oz / in)
[0111]
[0112] Table 7. The Z-axis contact resistance of Examples 7-8 (unit: mΩ)
[0113]
[0114]
Embodiment 9~10
[0116] According to the following table 8, examples 9-10 were obtained according to the preparation process of examples 1-6, the used slurry polymer was S3, the tackifying resin was UH115, the conductive particles were silver-plated glass microspheres, and polymer core-shell particles Choose 461DE20d70. The thickness of the obtained adhesive tape is controlled at 0.050-0.065mm. The performance test results of the embodiments are shown in Tables 9-10.
[0117] The formula composition of table 8. embodiment 9~10 (by weight)
[0118]
[0119] Table 9. Peel Adhesion of Examples 9-10 (unit: oz / in)
[0120]
[0121] Table 10. Z-axis contact resistance of Examples 9-10 (unit: mΩ)
[0122]
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