Light emitting diode packaging structure and manufacturing method thereof
A technology of light-emitting diodes and packaging structures, applied in electrical components, electric solid devices, circuits, etc., can solve problems such as prolonging the life of unfavorable LED light sources, poor heat dissipation of LED light sources, and unfavorable heat dissipation of LED light sources, and achieves improved heat dissipation effect and good insulation. good heat dissipation effect
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[0036] Such as Figure 1 to Figure 6 As shown, a light emitting diode package structure provided by the present invention includes a transparent substrate 1, an LED chip 5, and a wire support 34. The wire support 34 is mounted on the transparent substrate 1, the LED chip 5 is fixed on the transparent substrate, and the LED chip The electrode of 5 is connected to the wire support 34; the transparent substrate 1 is a transparent glass or a transparent sapphire substrate or a transparent ceramic or an organic transparent plastic.
[0037] Wherein, the light transmittance of the transparent substrate 1 is greater than 90%.
[0038] The single-sided, double-sided or three-dimensional surface of the transparent substrate 1 is uniformly plated with a transparent high thermal conductivity film 2. The required parameters of the transparent high thermal conductivity film 2 are: light transmittance greater than 90%, thermal conductivity greater than or equal to 400w / m·k; transparent The thic...
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