Multi-ceramic layer patterned structural substrates for optical and electronic devices

Abstract

The invention relates to a multi-ceramic layer patterned structural substrate for optical and electronic devices, which includes a metal base, and a pressure-resistant ceramic layer and a high-thermal-conduction ceramic layer are sequentially formed on the metal base; the pressure-resistant ceramic layer There is a transition layer between the high thermal conductivity ceramic layer and the high thermal conductivity ceramic layer and the transition layer through a mask to form a plurality of isolation bases; and a metal circuit layer is formed on the isolation base. The multi-ceramic layer patterned structure for optical and electronic devices described in the present invention has a larger size metal substrate and can accommodate multiple optical and / or electronic devices, and the multiple optical and / or electronic There is good electrical and thermal isolation between devices.

Description

technical field [0001] The invention belongs to the field of electronic technology, and more specifically, the invention relates to a multi-ceramic layer patterned structural substrate for optical and electronic devices. Background technique [0002] Devices used in optics and / or electronics, such as integrated circuits or laser diodes, require the use of thermally conductive materials for heat transfer. For this purpose, a metallic base body is used, for example a copper base body, and an electrical isolation is often required between the optical and / or electronic components and the metal base body. And some ceramic materials have higher heat transfer efficiency and are electrically insulating. For this purpose, highly thermally conductive ceramic materials are frequently used as intermediate materials for providing electrical isolation while still maintaining thermal conductivity between the optical and / or electronic components and the metal base body. In order to provid...

AI Technical Summary

Problems solved by technology

However, if the multiple optical and / or electronic devices are coupled to a ceramic component with a single interface, it will cause difficulty in heat transfer between the coupled optical and / or electronic devices, and may cause electrical conduction short circuit

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