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Multi-ceramic layer patterned structural substrates for optical and electronic devices

A technology for electronic devices and ceramic layers, applied in the field of electronics, can solve problems such as electrical conduction short-circuit and difficult heat transfer, achieve good electrical isolation and thermal isolation, solve heat dissipation problems, and high withstand voltage breakdown performance.

Active Publication Date: 2016-02-03
浙江云隐科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the multiple optical and / or electronic devices are coupled to a ceramic component with a single interface, it will cause difficulty in heat transfer between the coupled optical and / or electronic devices, and may cause electrical conduction short circuit

Method used

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  • Multi-ceramic layer patterned structural substrates for optical and electronic devices
  • Multi-ceramic layer patterned structural substrates for optical and electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] as attached figure 1 As shown, the multi-ceramic layer patterned structural substrate for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy substrate 10, and a SiC pressure-resistant ceramic layer 20 and AlN are sequentially formed on the metal substrate. High thermal conductivity ceramic layer 40; there is an aluminum transition layer 30 between the SiC pressure-resistant ceramic layer 20 and the AlN high thermal conductivity ceramic layer 40, and the AlN high thermal conductivity ceramic layer 40 and the aluminum transition layer 30 are selectively selected by a mask Etching forms a plurality of isolation pedestals 50; and forming a metal circuit layer (not shown in the figure) on the uppermost layer of the multi-ceramic layer of the isolation pedestals. The SiC pressure-resistant ceramic layer is prepared by an arc ion plating deposition method, and the thickness is 200um. Wherein, the step of the aluminum transition ...

Embodiment 2

[0024] as attached figure 2 As shown, the multi-ceramic layer patterned structural substrate for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy substrate 10, and a SiC pressure-resistant ceramic layer 20 and AlN are sequentially formed on the metal substrate. High thermal conductivity ceramic layer 40; there is an aluminum transition layer 30 between the SiC pressure-resistant ceramic layer 20 and the AlN high thermal conductivity ceramic layer 40, and an active braze is arranged between the aluminum alloy substrate 10 and the SiC pressure-resistant ceramic layer 20 Welding layer 60; and selectively etch the AlN high thermal conductivity ceramic layer 40 and the aluminum transition layer 30 through a mask to form a plurality of isolation bases 50; and form on the uppermost layer of the multi-ceramic layer of the isolation base metal circuit layer (not shown in the figure). The SiC pressure-resistant ceramic layer is prepare...

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Abstract

The invention relates to a multi-ceramic layer patterned structural substrate for optical and electronic devices, which includes a metal base, and a pressure-resistant ceramic layer and a high-thermal-conduction ceramic layer are sequentially formed on the metal base; the pressure-resistant ceramic layer There is a transition layer between the high thermal conductivity ceramic layer and the high thermal conductivity ceramic layer and the transition layer through a mask to form a plurality of isolation bases; and a metal circuit layer is formed on the isolation base. The multi-ceramic layer patterned structure for optical and electronic devices described in the present invention has a larger size metal substrate and can accommodate multiple optical and / or electronic devices, and the multiple optical and / or electronic There is good electrical and thermal isolation between devices.

Description

technical field [0001] The invention belongs to the field of electronic technology, and more specifically, the invention relates to a multi-ceramic layer patterned structural substrate for optical and electronic devices. Background technique [0002] Devices used in optics and / or electronics, such as integrated circuits or laser diodes, require the use of thermally conductive materials for heat transfer. For this purpose, a metallic base body is used, for example a copper base body, and an electrical isolation is often required between the optical and / or electronic components and the metal base body. And some ceramic materials have higher heat transfer efficiency and are electrically insulating. For this purpose, highly thermally conductive ceramic materials are frequently used as intermediate materials for providing electrical isolation while still maintaining thermal conductivity between the optical and / or electronic components and the metal base body. In order to provid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/14H01L23/373
Inventor 高鞠
Owner 浙江云隐科技有限公司
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