High reliability smd LED packaging structure

Abstract

The present invention relates to a high reliability SMD? The LED packaging structure includes a metal base, and a pressure-resistant ceramic layer is formed on the metal base, and a metal circuit layer and a high thermal conductivity ceramic layer are formed on the pressure-resistant ceramic layer; and on the metal circuit layer and high SMD is provided on the thermally conductive ceramic layer? LED? Lamp beads. The high reliability SMD described in the present invention? In the LED packaging structure, the thermal conductivity of the high thermal conductivity ceramic layer is greater than 50? W / mK,? Lateral and radial heat conduction can be realized, and the voltage-resistant ceramic layer has high voltage-resistant breakdown performance.

Description

technical field [0001] The invention belongs to the field of electronic technology, and more specifically, the invention relates to a high-reliability SMD LED packaging structure for optical devices. Background technique [0002] Devices used in optics and / or electronics, such as integrated circuits or laser diodes, require the use of thermally conductive materials for heat transfer. For this purpose, a metallic base body is used, for example a copper base body, and an electrical isolation is often required between the optical and / or electronic components and the metal base body. And some ceramic materials have higher heat transfer efficiency and are electrically insulating. For this purpose, highly thermally conductive ceramic materials are frequently used as intermediate materials for providing electrical isolation while still maintaining thermal conductivity between the optical and / or electronic components and the metal base body. In order to provide efficient heat tran...

AI Technical Summary

Problems solved by technology

With the development of optical and / or electronic devices, their performance requirements are becoming more and more stringent, such as the need to further improve the integration of integrated circuits, the need to improve the luminous efficiency of LEDs, etc., so that the ceramic intermediate layer The performance requirements are also getting higher and higher. For example, as a ceramic intermediate layer, it not only needs to have high thermal conductivity and electrical insulation rate, but also needs to have high voltage breakdown strength, and also needs to have fluorescence characteristics; these properties require a single ceramic function. Layers are often difficult to achieve, and studies have also shown that it is difficult to meet all requirements through composite ceramic coatings, and composite ceramic coatings often have large differences in thermal expansion coefficients of various components, and the internal heat produced by repeated cycles of different temperatures Stress can cause cracks in the ceramic layer and even lead to fracture failure

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