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Photosensitive water-developable resistance welding composition and photosensitive water-developable resistance welding dry film

A composition and water development technology, applied in optics, photography, photomechanical equipment, etc., can solve the problem of low adhesion of photosensitive water development solder mask dry film

Inactive Publication Date: 2013-10-30
HUIZHOU LIANDA ELECTRONICS MATERIAL
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] Based on this, it is necessary to address the problem of low adhesion of the existing photosensitive water-developable solder resist dry film, to provide a photosensitive water-developable solder resist composition with high adhesion and a product made from the photosensitive water-developable solder resist composition. Photosensitive water developing solder mask dry film

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  • Photosensitive water-developable resistance welding composition and photosensitive water-developable resistance welding dry film
  • Photosensitive water-developable resistance welding composition and photosensitive water-developable resistance welding dry film
  • Photosensitive water-developable resistance welding composition and photosensitive water-developable resistance welding dry film

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Embodiment Construction

[0039] In order to solve the problem of insufficient adhesion of traditional solder resist dry films, a photosensitive water-developable solder resist composition with high adhesion and a photosensitive water-developable solder resist dry film composed of the photosensitive water-developable solder resist composition are proposed. The following will be further elaborated through specific embodiments.

[0040] One embodiment of the photosensitive water-developed solder resist composition, which is composed of phthalic anhydride half-ester modified novolak epoxy acrylate, phenyl triphenol diacrylate and phthalic anhydride half-ester, novolak epoxy resin sebacate monoester, photoinitiated agent, colorant, plasticizer, inorganic filler, leveling defoamer, coupling agent, emulsifier, polymerization inhibitor and the rest of water.

[0041] The mass percent of the phthalic anhydride half-ester modified novolac epoxy acrylate is 5-50%, preferably 10-40%.

[0042] Phthalic anhydride ...

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Abstract

The invention relates to a photosensitive water-developable resistance welding composition composed of phthalic anhydride half-ester modified formaldehyde epoxy acrylate, phenyl triphenol diacrylate, anhydride half-ester, novolac epoxy resin sebacic monoester, a photoinitiator, a coloring agent, a plasticizer, inorganic filler, a leveling defoamer, a coupling agent, an emulsifying agent, a polymerization inhibitor and the balance of water. The phthalic anhydride half-ester modified formaldehyde epoxy acrylate can provide water solubility, water development property, good film forming property and contact drying property, so that the photosensitive water-developable resistance welding composition has higher adhesion force when applied to the preparation of a printed circuit board resistance welding diagram. The invention also provides a photosensitive water-developable resistance welding dry film prepared by using the photosensitive water-developable resistance welding composition.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a photosensitive water-developable solder resist composition and a photosensitive water-developable solder resist dry film. Background technique [0002] The traditional printed circuit board solder resist pattern is usually produced by the following methods: direct printing of the solder resist pattern on the screen plate; coating of a photosensitive wet film to cure it after exposure and development to produce a solder resist pattern; Curing produces a solder resist pattern. However, most dry films are developed by solvent after exposure, which will cause a large amount of volatile organic compound (VOC) emissions and pollute the environment. Although some dry films can also be developed with water, due to formula design and technical conditions, the adhesion of the solder mask dry film is often insufficient, and the solder mask pattern is prone to disconnection and strip...

Claims

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Application Information

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IPC IPC(8): G03F7/027H05K3/28
Inventor 赖卓宏
Owner HUIZHOU LIANDA ELECTRONICS MATERIAL
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