Power inductance structure free of use of lead frame and manufacturing method thereof

A technology of power inductors and manufacturing methods, which is applied to the structure of power inductors without lead frames and its manufacturing fields, and can solve problems such as high cost, product burnout, and difficulty in completely sealing magnetic materials.

Inactive Publication Date: 2013-10-30
INPAQ TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. During its manufacture, if the coil component is wound with flat wires, the winding process of the flat wires will be more complicated if it is considered that the two free ends of the coil must be located outside the coil.
[0005] 2. If Figure 1D As shown, if the coil assembly 10 is formed by winding round wires, the multi-layer structure of the round wires is difficult to meet the current requirements of light, thin, short, and small electronic components, and its cost is relatively increased.
[0006] 3. When manufacturing inductance, the coil component is welded first, then put it into the mold, and then put the magnetic powder material in the mold. In this way, it will be difficult for the coil component and the magnetic material covered by it to be completely bonded. question
[0007] 4. Due to the high number of overlapping turns of the wires of the coil, the electromagnetic interference between the multi-layer wires wil...

Method used

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  • Power inductance structure free of use of lead frame and manufacturing method thereof
  • Power inductance structure free of use of lead frame and manufacturing method thereof
  • Power inductance structure free of use of lead frame and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] 1. Prepare a lower substrate 201, which can be a magnetic soft magnetic carrier or a non-magnetic carrier, such as an iron oxide substrate or an aluminum oxide substrate or PET (such as Pic 4-1 shown);

[0055] 2. Form a plurality of separated conductive metal layers 202a, 202b, 202c... on the lower substrate 201. The conductive metal layers 202a, 202b, 202c... can be copper, silver, aluminum, tin, nickel or other conductive materials, or their mutual alloys superimposed on each other (such as Figure 4-2 shown).

[0056] 3. Use a wire package 203 to be arranged on the upper surface of the lower substrate 201. The wire package 203 is a plurality of coil units 203a, 203b... arranged in a matrix, and a coil is formed between two adjacent coil units 203a, 203b... The lead wires 203a1, 203a2, 203b1, 203b2 of the units 203a, 203b are formed, and the adjacent lead wires 203a2, 203b1 of two adjacent coil units may be the same. The material of this wire package 203 can be c...

Embodiment 2

[0064] 1. Prepare a lower substrate 301, which can be a magnetic soft magnetic magnet or a non-magnetic carrier, such as an iron oxide substrate or an aluminum oxide substrate or PET (such as Figure 5A shown);

[0065] 2. Form a plurality of separate conductive metal layers 302 on the lower substrate 301. The conductive metal layer 302 can be copper, silver, aluminum, tin, nickel or other conductive materials, or their mutual alloys are overlapped ( like Figure 5B shown);

[0066] 3. Use a wire package 303 to be arranged on the upper surface of the lower substrate 301. The wire package 303 is a plurality of coil units arranged in a matrix, and the lead wires of the coil units are formed between two adjacent coil units, and the adjacent Adjacent lead-out lines of the two coil units may be the same. The material of this wire pack 303 can be copper wire or other conductors, and this copper wire can be the enameled wire that has insulation layer on the surface, and this wire ...

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Abstract

Provided are a power inductance structure and a manufacturing method thereof. The power inductance structure comprises a lower substrate, a coil arranged on the lower substrate and an intermediate layer covering the coil. The lower substrate is a soft-magnetism magnet having magnetism or a carrier without magnetism, the coil is a wire with the surface provided with an insulating layer, and the intermediate layer is a colloid containing magnetic powder. The manufacturing method comprises the steps of enabling the coil which is an enameled wire, is made of a copper wire or other conductors and has the surface provided with the insulating layer to be fixed on the upper surface of the lower substrate, enabling the coil to be coated with the colloid internally containing the magnetic powder, cutting the substrate into grains, and performing forming in sequence. According to fixing of the coil, first a layer of graphical second conductor connected with conductor metal of the coil is formed above the substrate, the second conductor can lead electrical property of the coil out to an end electrode, and use of a lead frame is omitted simultaneously.

Description

technical field [0001] The present invention relates to a power inductor structure without a lead frame and a manufacturing method thereof, especially refers to that the whole chip production can be used to replace the existing single production method, so that the production rate of the power inductor is increased, the cost is reduced, and the produced power inductor is the same as Those with higher electrical connection reliability when the external electrodes are connected. Background technique [0002] Existing power inductors, as disclosed in U.S. Patent No. 6,204,744B 1, as shown in Figures 1A, 1B, 1C and 1D, the coil 10 is attached to a circuit board 12, which includes a The casing 14 extends from the casing 14 a first wire 16 and a second wire 18 , which are respectively welded to soldering points 20 and 22 on the circuit board. The coil 10 utilizes an upright flat wire with a rectangular cross-section to form a winding body 24, the coil becomes a helical shape, has...

Claims

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Application Information

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IPC IPC(8): H01F17/00H01F37/00H01F27/28H01F41/00
Inventor 李玮志
Owner INPAQ TECH
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