Power inductance structure free of use of lead frame and manufacturing method thereof

Abstract

Provided are a power inductance structure and a manufacturing method thereof. The power inductance structure comprises a lower substrate, a coil arranged on the lower substrate and an intermediate layer covering the coil. The lower substrate is a soft-magnetism magnet having magnetism or a carrier without magnetism, the coil is a wire with the surface provided with an insulating layer, and the intermediate layer is a colloid containing magnetic powder. The manufacturing method comprises the steps of enabling the coil which is an enameled wire, is made of a copper wire or other conductors and has the surface provided with the insulating layer to be fixed on the upper surface of the lower substrate, enabling the coil to be coated with the colloid internally containing the magnetic powder, cutting the substrate into grains, and performing forming in sequence. According to fixing of the coil, first a layer of graphical second conductor connected with conductor metal of the coil is formed above the substrate, the second conductor can lead electrical property of the coil out to an end electrode, and use of a lead frame is omitted simultaneously.

Description

technical field [0001] The present invention relates to a power inductor structure without a lead frame and a manufacturing method thereof, especially refers to that the whole chip production can be used to replace the existing single production method, so that the production rate of the power inductor is increased, the cost is reduced, and the produced power inductor is the same as Those with higher electrical connection reliability when the external electrodes are connected. Background technique [0002] Existing power inductors, as disclosed in U.S. Patent No. 6,204,744B 1, as shown in Figures 1A, 1B, 1C and 1D, the coil 10 is attached to a circuit board 12, which includes a The casing 14 extends from the casing 14 a first wire 16 and a second wire 18 , which are respectively welded to soldering points 20 and 22 on the circuit board. The coil 10 utilizes an upright flat wire with a rectangular cross-section to form a winding body 24, the coil becomes a helical shape, has...

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Problems solved by technology

[0004] 1. During its manufacture, if the coil component is wound with flat wires, the winding process of the flat wires will be more complicated if it is considered that the two free ends of the coil must be located outside the coil.

[0005] 2. If Figure 1D As shown, if the coil assembly 10 is formed by winding round wires, the multi-layer structure of the round wires is difficult to meet the current requirements of light, thin, short, and small electronic components, and its cost is relatively increased.

[0006] 3. When manufacturing inductance, the coil component is welded first, then put it into the mold, and then put the magnetic powder material in the mold. In this way, it will be difficult for the coil component and the magnetic material covered by it to be completely bonded. question

[0007] 4. Due to the high number of overlapping turns of the wires of the coil, the electromagnetic interference between the multi-layer wires will cause a large loss of inductance value

[0008] 5. In addition, because the current production of the above-mentioned power inductors still needs to be produced one by one, it consumes a lot of manpower and a long time, which reduces the production efficiency

In addition, the two ends of the coil are welded to the two legs of a lead frame respectively, and then the online frame of the lead frame is cut off to obtain the coil contact, which also causes material loss. This is to maintain it at a high cost reason

[0009] 6. In the existing power inductors, the coil is connected to the external electrodes in a point-to-point connection. In this way, when the temperature of the equipment used by the power inductor changes sharply or the current needs to be applied for a long time, the coil and the external electrodes are easily separated, resulting in a circuit breaker. Open circuit, in severe cases, it will cause the entire product to be burned

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