Chemical copper plating solution and preparation method thereof

A technology of electroless copper plating and copper chloride, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of easy oxidation of the surface of the coating and difficulty in guaranteeing the quality of the coating, so as to ensure the quality of the coating and avoid The effect of oxidation

Active Publication Date: 2013-12-04
BYD CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] The invention solves the technical problem in the prior art that the surface of the coating is easily oxidi...

Method used

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Embodiment approach

[0027] As a preferred embodiment of the present invention, the electroless copper plating solution contains copper chloride dihydrate, vanillin, disodium edetate, potassium sodium tartrate, potassium ferrocyanide, bipyridine, formaldehyde, Sodium Lauryl Sulfate and Sodium Hydroxide. More preferably, in the electroless copper plating solution, the content of disodium edetate is 10-40g / L, the content of potassium sodium tartrate is 10-40g / L, and the content of potassium ferrocyanide is 0.001 -0.1g / L, the content of bipyridine is 0.001-0.1g / L, the content of formaldehyde is 1-5g / L, the content of sodium lauryl sulfate is 0.001-0.1g / L, and the content of sodium hydroxide is 5-20g / L.

[0028] The present invention also provides the preparation method of described electroless copper plating liquid, comprises first copper chloride, vanillin, complexing agent, stabilizing agent, reducing agent and tensio-active agent are dissolved in water respectively to prepare respective aqueous s...

Embodiment 1-3

[0032] Prepare the electroless copper plating solution S1-S3 of the present embodiment by the formula in table 1, be specifically that earlier each component in table 1 is dissolved in water and be mixed with aqueous solution respectively, then copper chloride aqueous solution is mixed with complexing agent aqueous solution, And add sodium hydroxide aqueous solution to adjust the pH value, stir for 2 minutes and then add the aqueous solution of other components.

[0033] Table 1

[0034] .

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Abstract

The invention provides a chemical plating solution and a preparation method thereof. The chemical plating solution comprises cupric chloride, vanillin, a complexing agent, a stabilizing agent, a reducing agent and a surfactant. The content of the cupric chloride is 5-10 g/L. The content of the vanillin is 1-5 g/L. According to the chemical plating solution, the cupric chloride with strong permeability is utilized to provide bivalent copper ions and utilized as a source of deposited copper. In addition, the chemical plating solution comprises the vanillin, and the vanillin and the cupric chloride form a stable complex, thereby protecting plating from being oxidized and assuring the quality of the plating.

Description

technical field [0001] The invention belongs to the field of electroless copper plating, in particular to an electroless copper plating solution and a preparation method thereof. Background technique [0002] Since Brenner and Ridlell first developed the electroless copper plating technology in the 1940s, after half a century of hard work, this technology has been applied in various fields of the national economy. Electroless copper plating occupies a very important position in electroless plating, and has been widely used in various aspects such as the bottom layer of non-metallic plating, hole metallization of printed boards, and electromagnetic shielding layers of electronic instruments. [0003] At present, most commercial electroless copper plating solutions use formaldehyde as a reducing agent, and there are two basic chemical reactions in the reaction process, namely: [0004] Cu 2+ + 2e → Cu; [0005] 2HCHO + 4OH - → H 2 ↑+2H 2 O + 2HCOO - + 2e. [0006] T...

Claims

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Application Information

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IPC IPC(8): C23C18/40
Inventor 韦家亮
Owner BYD CO LTD
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