Single-sided etching equipment for semiconductor chips
A single-sided corrosion and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as uneven corrosion, low work efficiency, and easy corrosion of the front surface by corrosive liquid, so as to improve reliability and work efficiency. High efficiency, semi-automated corrosion, stable and reliable corrosion process
Active Publication Date: 2016-03-09
江苏新顺微电子股份有限公司
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Problems solved by technology
[0006] 1. The requirements for operators are high, and the corrosive liquid is easy to corrode the front;
[0007] 2. Bubbles are easy to remain in the center of the semiconductor chip, and local corrosion is uneven;
[0008] 3. The work efficiency is low, and the corrosive liquid has a strong suction force on the chip, which is easy to fragment
[0011] 1. The waste of corrosive liquid and water is serious and the cost is high;
[0012] 2. The operation is complicated, and the thin slices cannot be processed;
[0013] 3. Low work efficiency
[0015] The existing two devices have disadvantages such as low work efficiency, high cost, poor reliability, complicated operation, etc., but this device overcomes the above deficiencies
Method used
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[0039] see figure 1 , figure 1 It is a schematic diagram of the overall structure of the single-sided etching device suitable for semiconductor chips according to the present invention. Depend on figure 1 It can be seen that the present invention is applicable to a single-sided etching device for semiconductor chips, including a workbench 1, an etching system 2, an upper liquid system 3 and a circulating return system 4,
[0040] The corrosion system 2 is placed in the workbench 1, there are multiple corrosion systems 2, and the plurality of corrosion systems 2 are arranged side by side in the workbench 1; The liquid injection port 22 and the corrosive liquid injection port 22 are provided with a first damping plate 23 at the outlet. 21 The upper groove wall is provided with an overflow hole 26;
[0041] The upper liquid system 3 includes a liquid storage tank 31 and an upper liquid pump 32. The inlet of the upper liquid pump 32 is connected to the liquid storage tank 31 t...
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The invention relates to a single-face corrosion device applicable to a semiconductor chip. The single-face corrosion device comprises a workbench (1), corrosion systems (2), a liquid feeding system (3) and a circulation reverse-flow system (4). Each corrosion system (2) comprises a groove body (21), wherein a corrosive liquid injection port (22) is formed in the bottom of each groove body (21), a first damping plate (23) is arranged on an outlet of each corrosive liquid injection port (22), a second damping plate (24) is arranged in the middle of each groove body (21), each second damping plate (24) is vertically provided with a plurality of piece bearing pillars (25), and overflow holes (26) are formed in the groove wall of the upper portion of each groove body (21). The liquid feeding system (3) comprises a liquid storage tank (31) and a liquid feeding pump (32). The circulation reverse-flow system (4) comprises a third pipeline (41). According to the single-face corrosion device applicable to the semiconductor chip, a traditional single-face corrosion device is changed, the semiconductor chip can be fully corroded, corrosion semi-automation is achieved, and meanwhile product reliability and working efficiency are effectively improved.
Description
technical field [0001] The invention relates to a single-sided etching device suitable for semiconductor chips. It belongs to the technical field of integrated circuit or discrete device chip manufacturing. Background technique [0002] With the intensification of market competition in recent years, packaging manufacturers have put forward higher requirements for product yield, reliability, surface and other aspects. In order to meet the requirements of pressing the aluminum layer and other requirements, various semiconductor manufacturers have begun to adopt a new process-single-sided etching process. However, the single-sided corrosion devices currently used by various manufacturers have various shortcomings. [0003] Before the present invention is made, the commonly used single-sided etching device suitable for the pretreatment of the backside metallization of semiconductor chips mainly adopts the following two devices: [0004] Current device one: [0005] The semic...
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IPC IPC(8): H01L21/67
Inventor 谢坚明丁军叶新民冯东明王新潮
Owner 江苏新顺微电子股份有限公司