Solar backplane, encapsulation structure and solar cell module
A technology for solar back sheets and solar cells, applied in electrical components, circuits, photovoltaic power generation, etc., can solve problems such as heat resistance, poor hydrolysis resistance, poor UV resistance, and limitation of main materials.
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Embodiment 1
[0054] See figure 1 As shown, a solar back sheet 100 of a solar cell module, the solar back sheet 100 includes an adhesion layer 110, a main body layer 120 and an ultraviolet resistance layer 130, the main body layer 120 is interposed between the adhesion layer 110 and the ultraviolet resistance layer 130, and the adhesion layer 110 is used to attach the main body layer 120 to the EVA resin 200 of the solar cell module. The thickness of the main body layer 120 is 0.2 mm, the thickness of the adhesion layer 110 is 0.06 mm, and the thickness of the UV-resistant layer 130 is 0.04 mm.
[0055] Wherein, the adhesion layer 110 is a sea-lake-island coating structure, and the sea-lake-island coating structure includes several island units formed by the main material phase of the main body layer 120, several lake units formed by the compatibilizer material phase, and several lake units formed by the adhesion material phase. The sea unit is formed, wherein the sea unit covers the lake u...
Embodiment 2
[0061] The rest is the same as the above-mentioned embodiment 1, the only difference is that the main body layer 120 in this embodiment 2 includes: 70wt% of PPE resin, 15wt% of ASA resin, 5wt% of PS resin, PP resin and EVA resin mixed The added resin, 2.5wt% titanium dioxide, 2.5wt% antioxidant, 3wt% heat stabilizer and 2wt% plasticizer.
Embodiment 3
[0063] The rest is the same as the above-mentioned embodiment 1, the only difference is that the main body layer 120 in this embodiment 3 includes: 80wt% of PPE resin, 5wt% of ASA resin, 5wt% of PS resin, PP resin and PE resin mixed The added resin, 2.5wt% titanium dioxide, 2.5wt% antioxidant, 3wt% heat stabilizer and 2wt% plasticizer.
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Abstract
Description
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Application Information
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