Method for realizing welding between soft base chip circuit board and metal base body without special tool

Abstract

The invention provides a method for realizing welding between a soft base chip circuit board and a metal base body without a special tool, and aims to provide a local point-pressing welding method for the soft base chip circuit, which is capable of effectively avoiding the influences of cost, managing and unstable welding quality caused by the traditional special tool. The method is realized by the following technical scheme: firstly spreading tin at the back of the soft base chip circuit to flatten and homogenize a solder flow; then fixing a soft base chip at the welding groove of a cavity box (2) with the welding face coated with a welding flux by adopting a high temperature-resistant adhesive tape (4), placing the cavity body box (2) onto a heating board for heating, performing point pressing on the four edges and the central point and the position, which is slightly arched when people view by eyes, of the soft base chip by adopting a polytetrafluoroethylene rod (7) when the solder achieves the melting state, thus enabling the solder to be moisturized and expanded on the face of the cavity body box (2); finishing the welding of the soft base chip and taking down the cavity body box (2) for cooling. The method for realizing welding between the soft base chip circuit board and the metal base body without the special tool can realizes the aims of omitting the time for designing and machining the special tool and improving the production efficiency.

Description

technical field [0001] The invention relates to a welding process mainly used for local spot pressure of a dielectric soft substrate circuit board of a microwave / millimeter wave module assembly and a non-pressing plate of a metal base. Background technique [0002] Mounting the millimeter wave circuit soft substrate on the cavity box 2 is the basis for realizing effective interconnection between chips and components and providing mechanical support and electrical interconnection. Millimeter wave circuit substrate materials usually use RT / duroid5880, 5870, and the substrate thickness is 0.127mm and 0.254mm. It is also one of the key processes in the micro-assembly process technology, the assembly is difficult and the operation process is complicated. [0003] At present, the assembly method of millimeter-wave circuit soft substrate in the industry is based on the mounting process method based on alloy Sn / Pb alloy solder. The assembly method of alloy mounting has been widely...

AI Technical Summary

Problems solved by technology

[0006] In terms of management and cost: The products in the trial production, pre-research, and development stages are unstable, and there are links to repeatedly adjust the circuit and structure. Every time the adjustment is made, the tooling plate needs to be r

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