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An LED package

A technology for LED packaging and sealing parts, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of high color rendering index, narrow wavelength range of excitation light, and poor color purity, etc. The effect of displaying color gamut, improving picture quality, and good light stability

Active Publication Date: 2016-08-17
北京易美新创科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

5. Pre-test, whether the preliminary test can be bright
[0007] 1. The spectral peak is relatively wide, and the color purity is not very good;
[0008] 2. LED high color rendering index is difficult to achieve;
[0009] 3. The efficiency of phosphor is relatively low
However, the excitation wavelength range of traditional organic fluorescent dyes is narrow, and different fluorescent dyes usually require excitation light of multiple wavelengths to excite, which brings a lot of inconvenience to the actual research work.

Method used

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  • An LED package

Examples

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Embodiment 1

[0030] The present invention provides as attached figure 1 The LED package shown at least includes: a bracket 1 , a chip 3 , a bonding wire 4 , and a sealing component 2 . The bracket 1 is used to support the chip 3 and the bonding wire 4; the chip 3 is used to emit light that can effectively excite the phosphor powder 6 or the quantum dot 5; the bonding wire 4 is used to conduct the chip 3 and the bracket 1; Quantum dots 5 , located in the path of light emitted from the wafer 3 and having a lens shape, serve to wrap the wafer 3 and the holder 1 . The sealing part has four layers, which are carrier 21, fluorescent powder mixed with carrier 22, quantum dots mixed with carrier 23, carrier or a layer of sealing colloid 24 that blocks air moisture from inside to outside. The bracket 1 is made of iron plated with nickel and silver; the welding wire 4 is gold wire; the chip 3 can be a blue or ultraviolet chip, not limited to examples, as long as it can effectively excite fluorescen...

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PUM

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Abstract

The present invention provides an LED package, at least comprising: a bracket, a chip, a bonding wire, and a sealing member, the bracket is used to support the chip and the bonding wire; the chip is used to emit light that can effectively excite phosphors or quantum dots light; the bonding wire is used to conduct the wafer and the support; quantum dots are distributed inside the sealing member, located in the path of light emitted from the wafer and having a lens shape, for wrapping the wafer and the support The sealing part has four layers, which are carrier, fluorescent powder mixed with carrier, quantum dot mixed with carrier, carrier or a layer of sealing colloid that hinders air moisture from inside to outside. The LED package of the present invention can control the emission spectrum of the quantum dot by changing the size of the quantum dot; it has good photostability; it has a wide excitation spectrum and a narrow emission spectrum, effectively improving the color rendering index of the LED; luminous efficiency relatively high.

Description

technical field [0001] The invention relates to an LED packaging technology, in particular to a packaging form of a quantum dot LED. Background technique [0002] The English full name of LED is Light Emitting Diode, and the Chinese name is light-emitting diode (called light-emitting diode in Taiwan). It is a semiconductor optoelectronic device that converts electrical energy into light energy, including visible light (Visible) and invisible light (Invisible). It is a new generation of lighting source for optoelectronic semiconductors. Its main advantages are: high efficiency and low power consumption, energy saving and environmental protection, fast response and long life. [0003] LED (Light Emitting Diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. The packaging of the LED is not only required to be able to protect the wick, but also to be able to transmit light. Therefore, LED packaging has spe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/52H01L33/62
CPCH01L2224/48091
Inventor 刘国旭李文兵孙国喜范振灿
Owner 北京易美新创科技有限公司
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