Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Light emitting diode packaging structure

A technology for light-emitting diodes and packaging structures, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing light-emitting performance of light-emitting diode packages, decreasing light transmittance, and variability.

Inactive Publication Date: 2014-01-15
中山晨溪光电科技有限公司
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after being directly irradiated by short-wavelength (below 500 nm) light beams, bisphenol-A epoxy resins are highly susceptible to denaturation, resulting in a decrease in light transmittance, which ultimately affects the light extraction performance of the LED packaging structure and reduces the cost. Affected light extraction performance of light-emitting diode packages

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light emitting diode packaging structure
  • Light emitting diode packaging structure
  • Light emitting diode packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] see figure 1 , figure 2 and image 3 , The light emitting diode package structure 10 provided by the first embodiment of the present invention includes a substrate 11 , electrodes 12 , reflective cups 13 , light emitting diode die 14 and a package body 15 .

[0017] The substrate 11 is an insulating substrate, and its material can be insulating materials such as sapphire (Sapphire) and silicon carbide (SiC). The substrate 11 includes a carrying surface 110 (ie figure 1 The upper surface of the substrate 11 shown), the bottom surface 112 opposite to the carrying surface 110, the side surface 114 located between the carrying surface 110 and the bottom surface 112 and connecting the carrying surface 110 and the bottom surface 112, and the side facing away from the bottom surface 112 from the carrying surface 110 The direction protruding stopper 116. The stopper 116 is located at the bottom of the reflection cup 13 . Preferably, the size of the stopper 116 gradually d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A light emitting diode packaging structure comprises a substrate, electrodes disposed on the substrate, a reflection cup, light emitting elements and packaging bodies. A block, under the reflection cup, is formed on the substrate. The bottom space of the reflection cup is separated by the block into a first accommodation portion and a second accommodation portion that are not communicated with each other. The light emitting elements include a first light emitting diode crystal grain accommodated in the first accommodation portion and a second light emitting diode crystal grain accommodated in the second accommodation portion. The light emitting wavelength of the first light emitting diode crystal grain is less than that of the second light emitting diode crystal grain. The first accommodation portion is filled with cyclic aliphatic epoxy resin, and the second accommodation portion and the top space of the reflection cup are both filled with bisphenol A epoxy resin. The light emitting diode packaging structure exhibits good light emitting performance and is low in manufacture cost.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to a light emitting diode packaging structure. Background technique [0002] Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, it has been increasingly used in In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights. [0003] Existing LED packaging structures generally include a substrate, electrodes on the substrate, LED chips carried on the substrate and electrically connected to the electrodes, and a package covering the LED chips on the substrate. In the packaging process of the light emitting diode, in order to reduce the cost, the low cost bisphenol A epoxy resin is usually used to cover the light emitting diode chip as the packaging body. However, after being directly irradiated b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/075H01L33/56H01L33/48
CPCH01L2224/48091H01L2224/48137H01L2924/00014
Inventor 罗杏芬
Owner 中山晨溪光电科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com