Preparation method of surface metallized ceramic

A metallization and ceramic technology, applied in the field of surface metallized ceramics and its manufacturing, can solve the problems of inaccessibility of molten aluminum, inability to make films, non-wetting, etc., and achieve the effect of good physical and mechanical properties

Inactive Publication Date: 2014-01-22
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are also defects in the above method, that is, it is difficult to prepare thin films, especially thin films with a thickness less than 0.1 mm.
This is because the method uses a casting mold, and the casting mold must choose a material that does not react with aluminum and does not wet. If the mold gap is too small, the aluminum liquid cannot enter the casting mold, so the thin film cannot be produced.

Method used

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  • Preparation method of surface metallized ceramic
  • Preparation method of surface metallized ceramic
  • Preparation method of surface metallized ceramic

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1. Using the above-mentioned ceramic surface metallization device, put pure aluminum (99.9%) into a graphite crucible, and place an alumina ceramic plate (137 mm long, 35 mm wide, and 0.64 mm thick, produced by Tsinghua Yueke, with an alumina purity greater than 95 %) was inserted into a graphite guide rail passing through the crucible, and then heated in a nitrogen atmosphere (nitrogen flow rate of 20 L / min) to melt the aluminum and raise the temperature to 730 °C. Insert another alumina ceramic plate into the guide rail at a speed of 68.5mm / min from the guide rail entrance at the lower part of the device, and push the ceramic plate inserted into the guide rail to move vertically upward at the same speed. During the moving process, the ceramic plate contacts the aluminum melt in the crucible through the window on the guide rail, and then pushes out from the upper part of the guide rail together with the aluminum melt adhered to the surface, cools, and forms a...

Embodiment 2

[0032] Embodiment 2, except that the melt temperature is reduced to 700° C., is the same as embodiment 1. Form a dense aluminum film with an average thickness of 7 microns on the surface of the ceramics by this method, and the stripping rate of the adhesive tape test is 0. The experiment was repeated 3 times with the same results.

Embodiment 3

[0033] Embodiment 3, except that the melt temperature is increased to 760° C., is the same as embodiment 1. This method is used to form a dense aluminum film with an average thickness of 5 microns on the surface of the ceramics, and its tape test peeling rate is 0. The experiment was repeated 3 times with the same results.

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Abstract

The invention discloses surface metallized ceramic as well as a preparation method thereof. The method comprises the following steps: dipping a metallized treatment face of ceramic into aluminum or aluminum alloy melt, wherein the metallized treatment face moves relative to the melt, so that the aluminum or aluminum alloy melt wets the metallized treatment face of the ceramic; and then, moving the metallized treatment face of the ceramic out of the melt for freely cooling an aluminum or aluminum alloy liquid film attached to the surface to obtain the ceramic connected with the aluminum or aluminum alloy thin film on the surface. Compared with the prior art, no amorphous oxide impurities are available on the interface between the ceramic and the aluminum or aluminum alloy thin film, and grains of aluminum or aluminum alloy and ceramic grains directly grow together. The thin film formed is compact in internal tissue and free from oxide impurities. The aluminum or aluminum alloy thin film formed is several microns to dozens of microns in thickness, and the thin film is firm and not easy to fall. Experiments show that the chessboard partitioning and peeling strength of the aluminum or aluminum alloy thin film and the ceramic is greater than or equal to 4.1N / cm. The preparation method disclosed by the invention has a wide application prospect in the field of surface metallization of ceramic.

Description

[0001] This application is a divisional application with the application number 200910083280.6, the application date is April 30, 2009, and the invention name is "a surface metallized ceramic and its manufacturing method". technical field [0002] The invention relates to a surface metallized ceramic and a manufacturing method thereof. Background technique [0003] Ceramic has good thermal conductivity and insulation properties, and is a good packaging material. When used, it is generally necessary to carry out surface metallization treatment on ceramics to make circuits or solder electronic components. Traditional surface metallization methods include precious metal paste sintering method, Mo-Mn method, DBC method and active metal brazing method. Among them, the precious metal paste sintering method is to mix precious metal powder such as silver powder and glass powder, add binder, etc., prepare a slurry, coat it on the ceramic surface, and then sinter at about 900 ° C to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/88
Inventor 宁晓山李国才王波李莎
Owner TSINGHUA UNIV
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