Method for connecting ceramic and metal

A ceramic and metal technology, applied in the field of ceramic and ceramic and ceramic and metal connection, can solve the problems of shape and surface accuracy constraints, casting defects, difficult to guarantee dimensional accuracy, etc., and achieve good physical and mechanical properties, and the effect of dense organization

Active Publication Date: 2011-04-20
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the friction crimping method, ultrasonic crimping method and high vacuum cleaning crimping method need to apply a lot of pressure, so there are restrictions on the shape of metal or ceramics, and it is difficult to guarantee the dimensional accuracy after connection; and the casting method is essentially It is a casting method. On the one hand, casting defects are prone to appear inside the metal, and on the other hand, its shape and surface accuracy are also restricted.

Method used

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  • Method for connecting ceramic and metal
  • Method for connecting ceramic and metal
  • Method for connecting ceramic and metal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1. Using the above-mentioned ceramic surface metallization device, put pure aluminum into a graphite crucible, and insert an alumina ceramic plate (137 mm long, 35 mm wide, and 0.64 mm thick, produced by Tsinghua Yueke, with an alumina purity greater than 95%) through the In the graphite guide rail of the crucible, then feed nitrogen in the furnace (the nitrogen flow rate is 15 liters / min) (the oxygen volume content in the atmosphere in the furnace is 30 / million (i.e. 30ppm)) and energized heating to melt the aluminum and heat up to 700°C. The molten aluminum height after melting is 137mm. Insert another alumina ceramic plate into the guide rail at a speed of 68.5mm / min from the guide rail entrance at the lower part of the device, and push the ceramic plate inserted into the guide rail to move vertically upward at the same speed. During the moving process, the ceramic plate is in contact with the molten aluminum in the crucible through the window on the guid...

Embodiment 2

[0032] Embodiment 2, except that the brazing material is changed to Ak-8wt% Si alloy, the rest is the same as embodiment 1. There is no defect in the interface after connecting with aluminum, and the crack occurs in the clamping part of aluminum during the tear strength test. The experiment was repeated three times, and the tear strength was greater than 10.2kg / cm, indicating that the connection strength of the connection interface between the aluminum plate and the ceramic was at least greater than 10.2kg / cm.

Embodiment 3

[0033] Embodiment 3, except that the brazing material is changed to Al-4wt%Si alloy, the rest is the same as embodiment 1. After connecting with aluminum, there is no defect in the connection interface, and the fracture of the tear strength sample occurs in the clamping part of aluminum. The experiment was repeated three times, and the tear strength was greater than 9.7kg / cm, indicating that the interface connection strength between the aluminum plate and the ceramic was at least greater than 9.7kg / cm.

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Abstract

The invention discloses a method for connecting ceramic and ceramic, and ceramic and metal. The method comprises the following steps of: 1) forming a compact aluminum or aluminum alloy thin film with thickness of several to tens of microns on a connecting surface of the ceramic to obtain the ceramic with the connecting surface covered by the aluminum or aluminum alloy thin film; and 2) connectingthe ceramic with the connecting surface covered by the aluminum or aluminum alloy thin film and the metal by using the aluminum or aluminum alloy thin film, or connecting the ceramic with the connecting surface covered by the aluminum or aluminum alloy thin film and the ceramic with the connecting surface covered by the aluminum or aluminum alloy thin film by using the aluminum or aluminum alloy thin film. Compared with the prior art, the method has the advantages that: oxide inclusion originated from an aluminum surface oxide film is not formed on the interface between the aluminum film and the ceramic, which is formed by the method, the ceramic is firmly connected with the ceramic or the metal and the ceramic and the metal do not fall off easily, and the separating and peeling strength between the thin film and a ceramic chessboard is greater than or equal to 4.1N/cm. After an aluminum brazing process or an aluminum or aluminum alloy workpiece connection are adopted, defects of the connecting interface of the aluminum or aluminum alloy workpiece and the ceramic are avoided, the 90-degree tear strength of the connection can reach over 12kg/cm, fracture does not occur on the interface, and the ceramic and metal are connected very firmly.

Description

technical field [0001] The invention relates to a connection method of ceramics and ceramics and ceramics and metals. Background technique [0002] Ceramics have unique properties such as wear resistance, corrosion resistance, and high temperature resistance. In addition to being used as tableware and sanitary ware, ceramics are also an important engineering material, and are widely used in cutting heads and auto parts. In addition, ceramics also have excellent thermal conductivity and insulation properties, and are widely used as power semiconductor packaging substrates such as power transmission line insulating porcelain bottles, automotive spark plugs, highly integrated CPUs, thyristors, and IGBTs. However, due to the brittleness of ceramics, difficulty in machining, poor or non-conductive properties, it is often necessary to connect them with metals to make composite materials or parts in many occasions, and aluminum is an important engineering material whose consumption...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02C04B37/00
Inventor 宁晓山王波李莎
Owner TSINGHUA UNIV
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