A method and system for X-ray detection of defects in a multilayer packaging substrate

A detection method and packaging substrate technology, which is applied in the use of radiation for material analysis, etc., can solve the problems of lead wires affecting the reliability of MCM, weak connections, and affecting the wide application of MCM, and achieve the effects of accurate positioning, improved efficiency, and convenient detection

Active Publication Date: 2015-10-28
SOUTH CHINA UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Defects of multi-layer substrates such as broken or narrowed connections between through holes, scratches, cracks, weak connections, twisted, bent or broken leads, and interface contamination will affect the reliability of MCMs and affect the wide range of MCMs. application

Method used

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  • A method and system for X-ray detection of defects in a multilayer packaging substrate
  • A method and system for X-ray detection of defects in a multilayer packaging substrate

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Embodiment

[0062] Such as figure 1 Shown: a kind of X-ray 3D inspection method for multi-layer package substrate defect described in the present invention comprises the following steps:

[0063] (1) Acquisition of projection data;

[0064] (2) Reconstruction of two-dimensional tomographic images;

[0065] (2-1) Calculation of projection coefficient matrix;

[0066] (2-2) Transform the solution problem of two-dimensional tomographic images into a limited optimization problem;

[0067] (2-3) Apply the ART-TV method to solve the above-mentioned limited optimization problem;

[0068] (3) Reconstruction of three-dimensional images;

[0069] (3-1) Read two-dimensional X-ray CT tomographic image sequence;

[0070] (3-2) Two-dimensional tomographic image preprocessing;

[0071] (3-3) Two-dimensional tomographic image least squares B-spline fitting contour line;

[0072] (3-4) 3D reconstruction of two-dimensional tomographic image sequence MC algorithm.

[0073] (4) Virtually cut the obta...

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Abstract

The invention discloses a method and a system for X ray detection on multilayer package substrate defects. The method comprises the following steps of 1, projection data acquisition, 2, two-dimensional cross-sectional image reconstruction, 3, three-dimensional image reconstruction, 4, three-dimensional image virtual-cutting, 5, SURF feature-based registration on a two-dimensional slice X and the corresponding standard slice image, 6, corresponding matching point existence determination on the standard slice image according to a transformation matrix H, 7, opening operation on an obtained two-dimensional image, 8, connected domain labeling, 9, defect position computation and defect gray level value information determination, and 10, substrate defect mechanism determination. The method utilizes an X ray three-dimensional imaging technology to acquire cross-sectional images of the multilayer package substrate and to detect physical defects such as through holes and interconnection between the substrates, realizes automatic determination on the substrate defect mechanism by expert system evaluation on the various physical defect data, and improves production technology reliability.

Description

technical field [0001] The invention relates to a detection method and system for defects in substrates, in particular to an X-ray detection method and system suitable for multilayer packaging substrate defects. Background technique [0002] MCM (Multi-Chip Module) is a new technology that emerged and developed rapidly in the field of microelectronics in the 1990s. It is a combination of multiple large-scale integrated circuit LSI (Large Scale Integrated Circuit) The bare chip of the integrated circuit VLSI (Very Large Scale Integrated Circuit) is mounted and interconnected in a high-density printed circuit board PCB (Printed Circuit Board), multilayer ceramic (thick film) substrate or thin film multilayer wiring. On the substrate (silicon, ceramic or metal base), and then packaged as a whole to form a new type of microelectronic component that can complete the functions required by multi-functional, high-performance electronic components, complete machines, subsystems and e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N23/04
Inventor 高红霞陈科伟李致富胡跃明
Owner SOUTH CHINA UNIV OF TECH
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