The invention discloses a method and a
system for
X ray detection on multilayer
package substrate defects. The method comprises the following steps of 1, projection
data acquisition, 2, two-dimensional cross-sectional image reconstruction, 3, three-dimensional image reconstruction, 4, three-dimensional image virtual-
cutting, 5, SURF feature-based registration on a two-dimensional slice X and the corresponding standard slice image, 6, corresponding matching point existence determination on the standard slice image according to a
transformation matrix H, 7, opening operation on an obtained two-dimensional image, 8, connected domain labeling, 9, defect position computation and defect
gray level value information determination, and 10, substrate defect mechanism determination. The method utilizes an
X ray three-dimensional
imaging technology to acquire cross-sectional images of the multilayer
package substrate and to detect physical defects such as through holes and
interconnection between the substrates, realizes automatic determination on the substrate defect mechanism by
expert system evaluation on the various physical defect data, and improves production technology reliability.