Sealing agent for optical semiconductor devices, and optical semiconductor device

A technology for optical semiconductor devices and sealants, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve problems such as easy dust adhesion, component adhesion, and reduced productivity of optical semiconductor devices, so as to improve durability Thermal properties, cooling and heating cycle characteristics, stickiness suppression effect

Inactive Publication Date: 2014-01-29
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the case of using the above-mentioned sealant containing a silicone resin, since the surface of the cured product of the sealant is sticky, there is a problem that impurities such as dust tend to adhere to the surface.
In addition, if the surface of the cured product is sticky, there are also problems such as sticking between components and sticking to the pick up nozzle during actual mounting, resulting in a significant decrease in the productivity of optical semiconductor devices

Method used

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  • Sealing agent for optical semiconductor devices, and optical semiconductor device
  • Sealing agent for optical semiconductor devices, and optical semiconductor device
  • Sealing agent for optical semiconductor devices, and optical semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0261] (Synthesis example 1) Synthesis of the first organopolysiloxane represented by formula (1A)

[0262] Add 476 g of dimethyldimethoxysilane and 1,3-divinyl-1,1,3,3-tetramethyldisilazane to a 1000 mL detachable flask equipped with a thermometer, a dropping device, and a stirrer 5.3 g of oxane was stirred at 50°C. A solution obtained by dissolving 2.2 g of potassium hydroxide in 144 g of water was slowly added dropwise thereto, and after the dropwise addition, it was stirred and reacted at 50° C. for 6 hours to obtain a reaction liquid. Next, volatile components were removed under reduced pressure, and 2.4 g of acetic acid was added to the reaction liquid, followed by heating under reduced pressure. Then, potassium acetate was removed by filtration to obtain a polymer (A).

[0263] The number average molecular weight of the obtained polymer (A) was 5830. use 29 As a result of identification of the chemical structure by Si-NMR, the polymer (A) has the following average c...

Synthetic example 2

[0267] (Synthesis example 2) Synthesis of the first organopolysiloxane represented by formula (1A)

[0268] Add 486 g of dimethyldimethoxysilane and 1,3-divinyl-1,1,3,3-tetramethyldisilazane to a 1000 mL detachable flask equipped with a thermometer, a dropping device, and a stirrer 2.7 g of oxane was stirred at 50°C. A solution obtained by dissolving 2.2 g of potassium hydroxide in 144 g of water was slowly added dropwise thereto, and after the dropwise addition, it was stirred and reacted at 50° C. for 6 hours to obtain a reaction liquid. Next, volatile components were removed under reduced pressure, and 2.4 g of acetic acid was added to the reaction liquid, followed by heating under reduced pressure. Then, potassium acetate was removed by filtration to obtain a polymer (B).

[0269] The number average molecular weight of the obtained polymer (B) was 37,400. use 29 As a result of Si-NMR identification of the chemical structure, the polymer (B) has the following average co...

Synthetic example 3

[0272] (Synthesis Example 3) Synthesis of the First Organopolysiloxane Represented by Formula (1A)

[0273] Add 488 g of dimethyldimethoxysilane and 1,3-divinyl-1,1,3,3-tetramethyldisilane to a 1000 mL detachable flask equipped with a thermometer, a dropping device, and a stirrer 1.2 g of oxane was stirred at 50°C. A solution obtained by dissolving 2.2 g of potassium hydroxide in 144 g of water was slowly added dropwise thereto, and after the dropwise addition, it was stirred and reacted at 50° C. for 6 hours to obtain a reaction liquid. Next, volatile components were removed under reduced pressure, and 2.4 g of acetic acid was added to the reaction liquid, followed by heating under reduced pressure. Then, potassium acetate was removed by filtration to obtain a polymer (C).

[0274] The number average molecular weight of the obtained polymer (C) was 82800. use 29 As a result of identification of the chemical structure by Si-NMR, the polymer (C) has the following average co...

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Abstract

Provided is a sealing agent for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product thereof and is also capable of improving the heat resistance and temperature cycle characteristics of the cured product. A sealing agent for optical semiconductor devices of the present invention contains: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group that is bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom that is bonded to a silicon atom and a methyl group that is bonded to a silicon atom; and a catalyst for hydrosilylation reactions. The content ratios of the methyl groups bonded to silicon atoms in the first and second organopolysiloxanes are respectively 80% by mole or more. (R1R2R3SiO1 / 2)a(R4R5SiO2 / 2)b(R6SiO3 / 2)c Formula (1A) (R1R2R3SiO1 / 2)a(R4R5SiO1 / 2)b(R6SiO3 / 2)c Formula (1B) (R51R52R53SiO1 / 2)p(R54R55SiO2 / 2)q(R56SiO3 / 2)r Formula (51A) (R51R52R53SiO1 / 2)p(R54R55SiO2 / 2)q(R56SiO3 / 2)r Formula (51B).

Description

technical field [0001] This invention relates to the sealing compound for optical semiconductor devices used for sealing an optical semiconductor element in an optical semiconductor device. Moreover, this invention relates to the optical semiconductor device which used this sealing compound for optical semiconductor devices. Background technique [0002] Optical semiconductor devices such as light emitting diode (LED) devices have low power consumption and long life. In addition, the optical semiconductor device can also be used in a harsh environment. Therefore, optical semiconductor devices have been widely used in applications such as backlights for mobile phones, backlights for liquid crystal televisions, lamps for automobiles, lighting fixtures, and billboards. [0003] When an optical semiconductor element (for example, LED) which is a light emitting element used in an optical semiconductor device is in direct contact with the atmosphere, moisture or suspended dust i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08G77/12C08G77/20C08L83/05H01L33/56
CPCC08G77/20C08G77/70C08L83/04C08K5/56C08G77/12H01L33/56C08L83/00H01L23/29
Inventor 山崎亮介谷川满渡边贵志乾靖国广良隆金千鹤小林佑辅保井秀文末崎穣日下康成山田佑
Owner SEKISUI CHEM CO LTD
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