Improved manufacturing method of solar silicon wafer and solar silicon wafer

Abstract

The present invention discloses a method for manufacturing an improved solar silicon wafer and the solar silicon wafer. The method comprises the steps of firstly removing two heavy industry areas of a solar silicon rod to reserve a normal area, and then segmenting the solar silicon wafer from the normal area of the solar silicon rod, and carrying out the annealing treatment at a constant temperature for an action time after heating to an action temperature to form the solar silicon wafer. The manufacture method of the present invention enables the rigidity to be improved effectively, the breaking strength and the process yield to be increased, the silicon wafer cracks or the silicon wafer fragments to be reduced in a subsequent process and the production cost to be reduced. Moreover, the solar silicon wafer manufactured by the method of the present invention enables the photoelectric conversion efficiency to be improved, thereby achieving the purpose of producing the solar battery having better efficiency.

Description

technical field [0001] The invention relates to a manufacturing method of a solar silicon wafer and a solar silicon wafer, in particular to an improved manufacturing method of a solar silicon wafer and a solar silicon wafer that can increase hardness and flexural strength. Background technique [0002] Since solar energy is clean, safe and environmentally friendly, it has recently become an emerging energy source for generating electricity. A general solar cell is a device that converts solar energy into electrical energy. It forms a P-N junction through the combination of a P-type semiconductor and an N-type semiconductor. holes and electrons. Under the action of the electric field at the P-N junction, the holes drift to the P-type semiconductor, and the electrons drift to the N-type semiconductor, so a current can be generated. [0003] Solar cells can be broadly classified into wafer type solar cells and thin film type solar cells. The wafer-type solar cells are made o...

AI Technical Summary

Problems solved by technology

Since the silicon wafer and the solar cells it manufactures are both thin and brittle, when the external force exceeds the maximum load of the silicon wafer or the stress is excessively concentrated, it will cause cracks or fragments of the silicon wafer problems, resulting in a decline in the yield of the production process

In particular, the problem of fragments has a considerable impact on the solar cell (cell) factory in the subsequent process. Since the silicon wafers cannot be used after the fragments are generated, they can only be recycled and remelted, which will increase their production costs.

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