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Light emitting diode device with enhanced heat dissipation, and the method of preparing the same

A technology for light-emitting diodes and heat dissipation effects, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as damage to light-emitting diodes, and achieve the effect of solving heat dissipation problems and improving heat dissipation effects.

Inactive Publication Date: 2014-02-12
陈引干
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the metal substrate is used as the heat dissipation medium, the thermal expansion coefficient of the metal material is greater than that of the LED chip, and the LED chip is often damaged when the LED chip emits light and heats up.

Method used

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  • Light emitting diode device with enhanced heat dissipation, and the method of preparing the same
  • Light emitting diode device with enhanced heat dissipation, and the method of preparing the same
  • Light emitting diode device with enhanced heat dissipation, and the method of preparing the same

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preparation example Construction

[0047] The method for preparing a light-emitting diode device with improved heat dissipation provided by the present invention includes: providing a light-emitting diode chip with a light-emitting surface; forming a fluorescent layer on the light-emitting surface of the light-emitting diode chip; forming a plurality of cooling holes in the fluorescent layer, and The plurality of heat dissipation holes penetrate the fluorescent layer; and the heat conduction material is filled in the plurality of heat dissipation holes, wherein the thermal expansion coefficient difference between the heat conduction material and the fluorescent layer is less than 20ppm / K.

[0048] The above-mentioned fluorescent layer is a fluorescent colloid, a fluorescent plastic sheet, or a fluorescent ceramic plate, wherein the material of the fluorescent layer is oxide, nitride, nitrogen oxide, silicate, aluminate, phosphate, sulfide , sulfur oxides, or mixtures thereof; preferably yttrium aluminum garnet (...

Embodiment 1

[0057] Example 1 is to prepare the fluorescent layer with improved heat dissipation effect of the present invention, and test its heat dissipation effect. Provide a fluorescent layer using a fluorescent ceramic plate as the material of the fluorescent layer. The thickness of the fluorescent layer is 0.16mm. Laser drilling is used to manufacture heat dissipation holes that penetrate the fluorescent layer, and copper is used as a heat conduction material to fill the heat dissipation holes with a scraper. A fluorescent layer is formed to enhance the heat dissipation effect. The heat dissipation effect test method is to use infrared light with a power of 3W as a heat source to irradiate the fluorescent layer with improved heat dissipation effect, and use the NEC G100EX thermal imager to take a thermal image after 2 minutes. According to the thermal image analysis result, The highest temperature on the surface of the fluorescent layer with enhanced heat dissipation effect is 244.1°...

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Abstract

The present invention provides a light emitting diode device with enhanced heat dissipation, and the method of preparing the same. By forming the heat dissipating holes and trenches on the phosphor layer, and filling the heat dissipating holes and trenches on the phosphor layer with thermal conducting materials, the service life of the light emitting diode can be longer by reducing the thermal effect and improving the heat dissipation.

Description

technical field [0001] The invention relates to a light-emitting diode device for improving heat dissipation effect, and a preparation method thereof. Background technique [0002] With the development of science and technology, light-emitting diodes are widely used, and its peripheral integrated circuit components and heat dissipation technology are becoming more and more mature. The demand for high-power light-emitting diodes is also gradually increasing. However, the current high-power light-emitting diodes are often accompanied by poor heat dissipation. , thus leading to the degradation of the light-emitting diodes, therefore, the heat dissipation technology of the light-emitting diode components must be further improved to meet the heat dissipation requirements of high-power light-emitting diodes. [0003] The current common heat dissipation technology is to use a metal substrate or a ceramic substrate as the heat dissipation medium, and combine the bottom of the LED ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/50
CPCH01L33/641H01L33/508H01L33/44
Inventor 陈引干粘永堂马家伟
Owner 陈引干