Scanning method for manufacturing three-dimensional object layer by layer

Abstract

A scanning method for manufacturing a three-dimensional object layer by layer comprises the following steps: (1), dividing each section layer of a three-dimensional object to be manufactured into a thin-wall area and a non-thin-wall area: setting a threshold of the gap width of the section profile of the three-dimensional object, and according to the gap width of the section profile in x/y direction, dividing a coating area required to be scanned into a thin-wall area and a non-thin-wall area, wherein the thin-wall area is an area of which the gap width of the section profile is smaller than the threshold and the non-thin-wall area is an area of which the gap width of the section profile is greater than or equal to the threshold; (2), according to the thin-wall area and the non-thin-wall area, scanning area by area, wherein the non-thin-wall area is scanned, relatively high photon beam or particle beam power and relatively large light spot diameter are selected, and when the thin-wall area is scanned, relatively low photon beam or particle beam power and relatively large light spot diameter are selected. By the scanning method, constraints of efficiency and precision in the process of manufacturing the three-dimensional object layer by layer are balanced to the maximum extent, so that the efficiency is ensured and the accuracy and the surface quality of a machined part are ensured.

Description

technical field [0001] The present invention mainly relates to the technical field of layered manufacturing, in particular to a three-dimensional object scanning method suitable for layer-by-layer manufacturing technology, that is, in the process of layer-by-layer manufacturing of three-dimensional objects, the graphics area to be processed in each layer is divided into thin-walled Area and non-thin-walled area, so as to distinguish the scanning method. Background technique [0002] Devices involving "layer fabrication" in the prior art are known for example for stereolithography, laser sintering and electron beam melting, among others. These devices all include a support for positioning the object relative to the work surface, a device for applying the material in liquid or powder form, a focused photon beam or particle beam. When working, a layer of liquid or powder material is coated on the working surface through the coating device, and then the high-energy photon beam ...

AI Technical Summary

Problems solved by technology

In this way, the user can only scan and sinter according to the fixed setting parameters of the system, which often meets the processing accuracy, but the production efficiency is low or the processing accuracy is not enough, and the production efficiency is high.

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