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Gas barrier film and method for producing same

A technology for gas barrier and manufacturing method, which is applied in chemical instruments and methods, gaseous chemical plating, and devices for coating liquid on surfaces, etc., and can solve the problems of low film-forming productivity and inability to realize gas-barrier films, etc.

Active Publication Date: 2014-03-19
KONICA MINOLTA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] However, any technique is a deposition method using CVD, which has low film formation productivity and requires a reduced pressure environment.
Furthermore, in the gas barrier film produced by the coating method, no study on the mechanical properties of each layer has been reported, and the current situation is that it is impossible to achieve a water vapor transmission rate (WVTR) lower than 1×10. -2 g / m 2 Gas barrier film such as / day

Method used

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  • Gas barrier film and method for producing same
  • Gas barrier film and method for producing same
  • Gas barrier film and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0240] (Substrate physical properties and gas barrier properties)

[0241] "Production of Gas Barrier Film"

[0242] (Resin base material: support body)

[0243] As a resin base material (support body), a polyester film (A4300, manufactured by Toyobo Co., Ltd.) having a thickness of 125 μm which was subjected to an easy-adhesion process on both surfaces was used.

[0244] (Formation of Bleed-Out Prevention Layer)

[0245] The UV-curable organic / inorganic hybrid hard coating material OPSTAR Z7501 manufactured by JSR Corporation was coated on one side of the above-mentioned support, and after coating with a wire bar so that the film thickness after drying became 4 μm, the curing conditions were 1.0 J / cm 2 It hardened|cured at 80 degreeC of dry conditions for 3 minutes under the air using a high pressure mercury lamp, and formed the bleed-out prevention layer. The bleed-out prevention layer is common to all of the gas-barrier films 1 to 18 .

[0246] (Fabrication of substra...

Embodiment 2

[0311] Example 2 (physical properties of protective layer and gas barrier properties)

[0312] "Production of Gas Barrier Film"

[0313]

[0314]Using the substrate 1 produced in Example 1, 6 sheets of gas barrier films using the atmospheric pressure plasma CVD film as the gas barrier layer were produced in the same manner as the formation of the gas barrier layers of the gas barrier films 1-1 to 1-6 in Example 1. The gas barrier film was formed on the gas barrier layer with a total film thickness of 500 nm by forming a film of the raw material used for the bottom layer in the substrates 1 to 6 of Example 1 and the treated film to obtain gas barrier films 2-1 to 2-6 as a protective layer. In addition, the film thickness of the UV-curable acrylic resin film in 2-2 and 2-5 was 350 nm.

[0315]

[0316] Using the substrate 1 produced in Example 1, 6 excimer light-modified films of polysilazane were prepared in the same manner as the formation of the gas barrier layers of th...

Embodiment 3

[0325] Example 3 (underlayer, combination of protective layers and gas barrier properties)

[0326] "Manufacturing of Gas Barrier Films"

[0327]

[0328] A gas-barrier film having a combination of the primer layer of Example 1 and the protective layer of Example 2 was produced. The base material and the cover material are combined identically. For specific raw materials, record them in Tables 5 and 6. About the gas barrier layer, it produced similarly to Example 1, and the raw material and manufacturing method used for each film are described in Tables 5 and 6.

[0329] "Evaluation of Gas Barrier Films"

[0330] For the produced gas barrier film, the hardness and elastic recovery rate of the base layer and the protective layer, and the water vapor transmission rate of the gas barrier film were evaluated in the same manner as in Example 1. It should be noted that the level using the substrate 2 and the substrate 3 could not be evaluated for the water vapor transmission r...

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Abstract

To provide a gas barrier film which has high gas barrier performance and a method for producing a gas barrier film with excellent continuous productivity. A gas barrier film, which is obtained by laminating at least one gas barrier layer on a resin substrate, and wherein the hardness and the elastic modulus recovery ratio of at least one layer that is adjacent to the gas barrier layer satisfy 0.5 GPa = hardness = 5.0 GPa and 50% = elastic modulus recovery ratio = 100% as determined by nanoindentation measurement.

Description

technical field [0001] The present invention relates to a gas barrier film having a gas barrier layer and a method for producing the same. More specifically, it mainly relates to a gas barrier film used for packaging of electronic devices, etc., solar cells, organic EL elements, and display materials such as plastic substrates such as liquid crystals, and a method for producing the same. Background technique [0002] Conventionally, gas-barrier films in which thin films of metal oxides such as aluminum oxide, magnesium oxide, and silicon oxide are formed on the surfaces of plastic substrates and films have been used in packaging applications for articles that require blocking of various gases such as water vapor and oxygen. It is widely used in packaging applications for preventing deterioration of food, industrial supplies, and pharmaceuticals. In addition to packaging applications, it is also used in liquid crystal display elements, solar cells, organic electroluminescenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/02B32B37/00
CPCB32B2307/536B32B2307/7242B32B7/02B05D3/007B32B27/06B32B33/00B32B2307/51C23C16/0272C23C16/401
Inventor 本田诚
Owner KONICA MINOLTA INC