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Dicing-tape-integrated adhesive sheet, semiconductor device, multilayered circuit board and electronic component

A technology for cutting tapes and adhesive sheets, used in semiconductor devices, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as difficulty in ensuring insulation between adjacent terminals, and difficulty in ensuring reliability of electronic components and semiconductor devices. Excellent workability

Inactive Publication Date: 2014-03-19
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in these methods, since conductive particles exist between adjacent terminals, it is difficult to ensure the insulation between adjacent terminals, and it is difficult to ensure the reliability of electronic parts and semiconductor devices because air bubbles exist between adjacent terminals.

Method used

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  • Dicing-tape-integrated adhesive sheet, semiconductor device, multilayered circuit board and electronic component
  • Dicing-tape-integrated adhesive sheet, semiconductor device, multilayered circuit board and electronic component
  • Dicing-tape-integrated adhesive sheet, semiconductor device, multilayered circuit board and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0199]

[0200] A weight-average molecular weight of 300,000 obtained by copolymerizing 30% by weight of 2-ethylhexyl acrylate and 70% by weight of vinyl acetate was applied to a polyester film with a thickness of 38 μm after mold release treatment so that the thickness after drying became 10 μm. 100 parts by weight of copolymer, 45 parts by weight of pentafunctional acrylate monomer with a molecular weight of 700, 5 parts by weight of 2,2-dimethoxy-2-phenylacetophenone and toluene diisocyanate (CORONATE T-100, Nippon Polyurethane Industry Co., Ltd.) 3 parts by weight, and then dried at 80° C. for 5 minutes. Furthermore, the obtained coating film was irradiated with ultraviolet rays of 500 mJ / cm 2 , forming an interlayer on the polyester film.

[0201]

[0202] A varnish for an adhesive layer of a dicing tape prepared by blending 100 wt. and 3 parts by weight of toluene diisocyanate (CORONATE T-100, manufactured by Nippon Polyurethane Industry Co., Ltd.). The above-ment...

Embodiment 2）

[0227] The dicing tape-integrated adhesive sheet and semiconductor device were produced in the same manner as in Example 1 except that the varnish for an adhesive film was produced as follows.

[0228]

[0229] In the preparation of the varnish for the adhesive film, 20.4 parts by weight of cresol novolac type resin (manufactured by DIC Corporation, KA-1160) was changed to 15.0 parts by weight, and bisphenol F type epoxy resin (manufactured by DIC Corporation, EXA- 830LVP) 56.8 parts by weight was changed to 45.0 parts by weight of bisphenol A epoxy resin (manufactured by DIC Corporation, EPICLON-840S), and 15.0 parts by weight of trimellitic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) was changed to 2,3-naphthalenedi Carboxylic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) 15.0 parts by weight, 7.2 parts by weight of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, YX-6954) was changed to 24.4 parts by weight of urethane acrylate polyme...

Embodiment 3）

[0231] A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for the adhesive film was prepared as follows.

[0232]

[0233] In preparing the varnish for the adhesive film, 20.4 parts by weight of cresol novolak-type resin (manufactured by DIC Corporation, KA-1160) was changed to 10.1 parts by weight of biphenylaralkyl-type phenol (manufactured by Meiwa Kasei Co., Ltd., MEH-7851H) In parts by weight, 56.8 parts by weight of bisphenol F-type epoxy resin (manufactured by DIC Corporation, EXA-830LVP) was changed to 31.0 parts by weight, and 15.0 parts by weight of trimellitic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) was changed to phenolphthalein (Tokyo Kasei Kogyo Co., Ltd.) 11.2 parts by weight, 7.2 parts by weight of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, YX-6954) was changed to 14.5 parts by weight of methacrylate polymer (manufactured by Negami Kog...

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Abstract

The present invention provides a dicing tape integrated adhesive sheet with an excellent workability that is capable of connecting terminals of opposing members and concurrently sealing into a space between the opposing members. The dicing tape integrated adhesive sheet of the present invention has a laminated structure that is formed of an adhesive film for electrically connecting first terminal on a support and second terminal on a adherend by using solder and adhering between the support and the adherend; and a dicing tape. It satisfies the relationship of 1.2*10<3> <= (T*P) / [eta] <= 1.5*10<9>, wherein T[DEG C] is an attaching temperature at which the adhesive film is attached to a surface on which the first terminal of the support is formed, P[MPa] is a pressure applied to the adhesive film, and [eta][Pa.S] is a melt viscosity of the adhesive film under the attaching temperature.

Description

technical field [0001] The present invention relates to a dicing tape-integrated adhesive sheet, a semiconductor device, a multilayer circuit board, and an electronic component. [0002] this application claims priority based on Japanese Patent Application No. 2011-152370 for which it applied to Japan on July 8, 2011, The content is used here. Background technique [0003] With the requirement of higher functionality and miniaturization (thinner and shorter) of electronic equipment in recent years, high-density integration and high-density mounting of electronic components such as semiconductor packages have been developed. The miniaturization and multi-pin of these electronic components transformation is also going on. To obtain electrical connections of these electronic components, solder joints are used. [0004] Examples of the solder bonding include a conductive bonding portion between semiconductor chips, a conductive bonding portion between a semiconductor chip and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/301C09J7/02C09J11/06C09J161/06C09J163/00C09J171/12H01L21/60C09J7/35
CPCH01L2224/83862H01L2224/13111H01L24/83H01L24/29H01L2224/9211C09J2463/00H01L2224/75745H01L24/92H01L2221/68381H01L2221/68336C09J2203/326H01L2224/81815H01L2221/68377H01L21/67144H01L24/73C09J7/0203H01L2224/73204C09J161/06H01L2224/2919H01L2224/83191C09J7/02C09J163/00C09J2461/00H01L21/6836C08G59/4223H01L24/81H01L24/75C08L63/00C08L61/06H01L2924/00014H01L24/32H01L2224/92125H01L2224/32135H01L2224/16145H01L2224/16227H01L2224/32225H01L2224/16225C09J7/35Y10T428/2809Y10T428/2848Y10T428/24843H01L2924/01047H01L2924/00012H01L2924/0665H01L2924/00C09J11/06H01L21/30H01L21/78
Inventor 前岛研三
Owner SUMITOMO BAKELITE CO LTD