Method for cleaning diamond wire cut silicon wafers

Abstract

The invention discloses a method for cleaning diamond wire cut silicon wafers. The method for cleaning the diamond wire cut silicon wafers comprises the steps that the cut silicon wafers are pre-cleaned, and activated cleaning is carried out on the pre-cleaned silicon wafers through an activated cleaning agent, wherein the activated cleaning agent is a mixed reagent formed by pure water, sodium hydroxide and hydrogen peroxide. According to the method, impurities such as organic matters, bacteria, reducible metal ions remained on the surfaces of the silicon wafers can be removed effectively through the hydrogen peroxide strong in oxidizing property; by controlling the concentration of the sodium hydroxide in the activated cleaning agent, the activated cleaning agent can only react with portions, with large flaws and damage, of the surfaces of the silicon wafers, the damage portions of the surfaces of the silicon wafers are removed, the surfaces of the silicon wafers have the same contact condition with a texture surface making reagent in the subsequent texture surface making process, namely, the reaction speeds of all portions of the surfaces of the silicon wafers with the texture surface making reagent are identical, and thus the silicon wafers after texture surface making have good texture surfaces. Therefore, the method for cleaning the diamond wire cut silicon wafers can effectively improve the cleanliness of the surfaces of the silicon wafers, and the evenness of the texture surfaces of the silicon wafers after the texture surface making is good.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cleaning technology, in particular to a method for cleaning silicon wafers cut by diamond wires. Background technique [0002] In today's increasingly tense energy environment, the research and development of new energy sources is a major topic in the energy field. Solar energy has become a main direction of research and development in the field of energy due to its advantages of non-pollution, inexhaustibility, and no regional restrictions. The use of crystalline silicon solar cells for photoelectric power generation is a major way of utilizing solar energy today. Silicon wafer is the carrier of crystalline silicon solar cells. It is prepared by cutting crystalline silicon rods. The cleaning effect of silicon wafers has an important impact on the texturing of silicon wafers and even the conversion efficiency of solar cells. [0003] In order to obtain silicon wafers with high cleanliness,...

AI Technical Summary

Problems solved by technology

As we all know, the effect of diamond wire cutting on the surface morphology of silicon wafers is different from that of mortar cutting. If you continue to use traditional cleaning methods to clean silicon wafers cut by diamond wire, it cannot effectively remove impurities on the surface of silicon wafers. The cleanliness of the wafer surface is low, and the uniformity of the textured surface of the silicon wafer is poor

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