Method for preparing annular moderate-temperature Ag-Cu-Sn brazing filler metal piece

A technology of ag-cu-sn and circular ring, which is applied in the field of preparation of circular Ag-Cu-Sn medium-temperature solder, can solve the problems such as the difficulty of forming medium-temperature solder, and achieve the reduction of raw material costs, easy control, and particle size The effect of uniform diameter distribution

Inactive Publication Date: 2014-03-26
UNIV OF SCI & TECH BEIJING
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Problems solved by technology

[0004] The object of the present invention is to provide a method for preparing circular Ag-Cu-Sn medium-temperature brazing filler metal by powder metallurgy, by mechanically alloy

Method used

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  • Method for preparing annular moderate-temperature Ag-Cu-Sn brazing filler metal piece
  • Method for preparing annular moderate-temperature Ag-Cu-Sn brazing filler metal piece
  • Method for preparing annular moderate-temperature Ag-Cu-Sn brazing filler metal piece

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Embodiment Construction

[0021] Ag powder, Cu powder and Sn powder were used as the original powder in the experiment. Choose Ag content 43 wt.%, Sn content 45 wt.%, Cu content 12 wt.%. The particle size range of the Ag powder is 2-10 μm, the particle size range of the Cu powder is 2-15 μm, and the particle size range of the Sn powder is 20-35 μm. According to the ratio of ball to material 2:1, put it into a polytetrafluoroethylene ball mill tank, the diameter of the carbide ball is 6, 8 and 10mm, the ratio is 40:50:10, and the ball mill tank is filled with argon protective gas . The speed of the ball mill is 200-500r / min, and the ball milling time is 40-70h. After ball milling, place the alloyed powder in a designed ring-shaped mold with an outer diameter of Φ5 and an inner diameter of Φ3, and press with a pressing pressure of 5-35 MPa to obtain an alloy sheet with an outer diameter of Φ5 and an inner diameter of Φ3 and a thickness of 200 μm. Finally, the formed alloy sheet is placed in a reducing...

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Abstract

The invention belongs to the technical field of electronic packaging brazing, and discloses a method for preparing an annular moderate-temperature Ag-Cu-Sn brazing filler metal piece in a pressing and thermal processing mode through Ag-Cu-Sn alloy powder which is prepared through a mechanical alloying method. The method includes the steps of placing simple-substance Ag powder, simple-substance Cu powder and simple-substance Sn powder which are weighed according to a certain mass ratio and are within a certain particle size range into a ball grinding machine container so that mechanical alloying can be conducted, then, placing the prepared alloy powder into a specific die so that pressing forming can be conducted, and finally, conducting thermal processing on a formed green body to obtain a brazing filler metal piece. The method is simple in process and low in cost, components are easy to control, the shape of the prepared Ag-Cu-Sn brazing filler metal piece is easy to control, the melting range is from 450 DEG C to 500 DEG C, wettability of a base body plated with Ni is good, and the wetting angle of the base body is smaller than 5 degrees.

Description

technical field [0001] The invention relates to a method for preparing a circular-shaped Ag-Cu-Sn medium-temperature solder, in particular to a method for preparing Ag-Cu-Sn medium-temperature solder with excellent performance by adopting a mechanical alloying method combined with pressing and heat treatment. Background technique [0002] Today, with the development trend of miniaturization and high integration of electronic products, the packaging technology of electronic products is gradually entering the era of microelectronics. With the development trend of light, thin, short and small electronic products and the continuous updating of microelectronic technology, microelectronic packaging technology has gradually entered a stage of rapid development with the characteristics of high density and high performance, and has become the mainstream of today's electronic packaging technology. At the same time, as the integration level of the chip continues to increase, the volume...

Claims

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Application Information

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IPC IPC(8): B23K35/40C22C1/04
CPCB23K35/40C22C1/0425
Inventor 吴茂贾占辉何新波曲选辉
Owner UNIV OF SCI & TECH BEIJING
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