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Nickel plating solution and method for forming nickel plating layer using the same

A technology of nickel plating and solution, applied in the field of nickel plating solution and using it to form nickel plating, which can solve the problem of high risk of product damage

Inactive Publication Date: 2014-03-26
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case where coating is performed, cost and time are required because an additional step is used before plating, and in the case where the quality of the coating film is poor, the risk of product damage is high

Method used

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  • Nickel plating solution and method for forming nickel plating layer using the same
  • Nickel plating solution and method for forming nickel plating layer using the same
  • Nickel plating solution and method for forming nickel plating layer using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Prepared the nickel plating solution that comprises the nickel ion of 80g / L, the nickel chloride of 15g / L concentration, the boric acid of 15g / L and the succinic acid of 40g / L, and by using sulfuric acid and nickel hydroxide The pH was adjusted to 5.5.

[0053] Nickel and tin plating was performed on external electrodes of chip parts having a body containing manganese oxide (semiconductor ceramics containing Mn, Ni, Al, and Co) by using a nickel plating solution at a nickel plating solution temperature of 50°C.

Embodiment 2

[0055] Plating was performed on the chip part in the same manner as in Example 1, except that sodium gluconate was used as the organic acid of the nickel plating solution of Example 1 instead of succinic acid.

[0056] control group

[0057] Regarding the chip part having the body containing manganese oxide before the plating layer was formed on the external electrodes, as a control group, the corrosion or no corrosion of the body due to the formation of the nickel plating layer was compared between the plating solutions of the comparative example and the example.

experiment example 1

[0058] Experimental example 1: Confirmation of corrosion of the main body

[0059] When each of the nickel plating solutions prepared according to Example 1 and Comparative Example 1 was used to form a nickel plating layer on an external electrode of a chip part having a body containing manganese oxide, the thickness of the body was confirmed by observing its cross section through an optical microscope. Corroded or not corroded. result in Figures 1 to 3 shown in .

[0060] figure 1 is an image of the side surface of the chip component before the nickel electrode layer is formed on the external electrode 20 . refer to figure 1 , in the case of Comparative Example 1 in which a nickel plating layer was formed on the external electrode 20 by using a prior art nickel plating solution, as in figure 2 As shown in , the body 10 is corroded, so a significant reduction in the thickness of the body (T2) can be observed compared to the thickness of the body before plating (T1). ...

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PUM

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Abstract

Disclosed herein are a nickel plating solution and a method for forming a nickel layer. Concretely, disclosed is a method for forming a nickel layer on an external electrode of a chip component by using the nickel plating solution. The nickel plating solution includes: a nickel ion; a chloride ion; and a pH buffer, wherein the pH buffer is used by mixing an inorganic acid, an organic acid and a salt thereof, so that the damage to a body of the chip component can be reduced by containing organic acid and a salt thereof in the nickel plating solution for forming the nickel plating layer on the external electrode of the chip component having a body formed of a material including ferrite or manganese oxide.

Description

[0001] References to related applications [0002] This application claims the benefit of Korean Patent Application No. 10-2012-0100435, filed September 11, 2012, entitled "Nickel Plating Solution and Method for Forming Nickel Plating Layer Using The Same," the entire contents of which are incorporated by reference into this application. technical field [0003] The present invention relates to nickel plating solutions and methods of using the same for forming nickel deposits. Background technique [0004] Generally, as an external electrode of a chip part in an electronic part, nickel or tin plating is formed on an underlying metal material by electroplating. The tin plating is used as a solder layer when assembling printed circuit boards, while the nickel plating is used as a barrier between the external electrodes and the solder. [0005] For nickel plating, a nickel plating solution is used and mainly a sulfamate bath or a watt bath is used. However, in the case where...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/12
CPCC25D5/12C25D3/12C25D7/12C25D21/12C25D3/56
Inventor 金美昑南孝昇
Owner SAMSUNG ELECTRO MECHANICS CO LTD