Detection method of micro-region surface temperature distribution of integrated circuit chip based on colloidal lead selenide quantum dots
An integrated circuit and detection method technology, applied in the field of integrated circuit chip surface temperature detection, can solve the problems of inability to detect the micron-level area temperature of integrated circuits, poor infrared image or video effect, large volume and weight of detection equipment, etc., to achieve The effect of simple structure, low cost and simple operation
Inactive Publication Date: 2016-01-20
JILIN UNIV
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Problems solved by technology
[0009] The technical problem to be solved by the present invention is to overcome the problems existing in the prior art such as large volume and weight, complex structure and operation, poor infrared image or video effect, and inability to detect the temperature of the micron-scale area of the integrated circuit. Provides a method for detecting the surface temperature distribution of integrated circuit chip micro-regions based on colloidal lead selenide quantum dots
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[0063] The present invention is described in detail below in conjunction with accompanying drawing:
[0064] 1. Refer to figure 1 and figure 2 , the temperature detection method based on the colloidal PbSe quantum dots of the present invention to the surface of the micro-region of the integrated circuit chip is as follows:
[0065] The first step, preparation of colloidal PbSe quantum dots
[0066] Put 0.892g of PbO (4.000mmol), 2.600g of OA (8.000mmol) and 12.848g of ODE into a three-necked flask, and heat the mixed solution to 170°C under nitrogen protection until all PbO is dissolved and the solution becomes Colorless, then prepare a Se-TBP solution with a mass ratio of 10%, take out 6.4g and inject it into the rapidly stirred reaction solution, drop the temperature and keep it at 140°C, let the colloidal PbSe quantum dots grow for 4 minutes at this temperature, Then quickly inject excess room temperature toluene solution to extinguish the reaction, and finally use chlo...
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Abstract
The invention discloses a surface temperature distribution detecting method for a micron-scale region of an integrated circuit chip based on colloidal PbSe quantum dots. The method is used for solving the problems in the prior art that the temperature detection on a micron-scale region of an integrated circuit cannot be completed, detection equipment is large in size and weight and complicated in structure, and the like. The method comprises the steps: preparing the colloidal PbSe quantum dots; depositing the colloidal PbSe quantum dots on the surface of an integrated circuit board; selecting a laser as an excitation light source and forming parallel beams; irradiating the colloidal PbSe quantum dots on the surface of the chip by laser beams, so as to enable the colloidal PbSe quantum dots to produce photoluminescence; collecting infrared light by an image acquisition system; receiving infrared light signals by an infrared spectrograph, and displaying corresponding a luminescent spectrum; calculating the temperature of one point of the surface of the micron-scale region of the integrated circuit chip.
Description
technical field [0001] The present invention relates to the field of temperature detection on the surface of an integrated circuit chip, and more specifically, the present invention relates to a method for detecting temperature distribution on the micron-scale surface of an integrated circuit chip based on colloidal lead selenide quantum dots (PbSe quantum dots). Background technique [0002] With the rapid development of communication and electronic industries, integrated circuit chips are widely used in required electronic equipment. These electronic devices are often used for important tasks such as data processing and transmission. Without a good integrated circuit chip temperature detection system and heat dissipation system, not only will the equipment be damaged, but it will also bring incalculable economic losses. [0003] Traditional temperature detection methods mainly use infrared cameras to scan and measure the surface temperature of integrated circuit chips, or ...
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IPC IPC(8): G01K11/20
Inventor 张宇王鹤林翟微微于伟泳刘文闫王一丁张铁强王国光
Owner JILIN UNIV