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Method for preparing printed circuit board embedded resistor ink-jet printing ink

A printed circuit board, inkjet printing technology, applied in ink, household utensils, applications, etc., can solve the problems of poor dispersibility, easy delamination, low Tg, etc., achieve good dispersibility, realize mutual solubility, improve Dispersion effect

Inactive Publication Date: 2015-02-18
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing ink drops are easy to delaminate after being dropped on the substrate, the dispersibility is not good, and the Tg after curing is low, and the resistance value of the square resistance formed after curing is small

Method used

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  • Method for preparing printed circuit board embedded resistor ink-jet printing ink
  • Method for preparing printed circuit board embedded resistor ink-jet printing ink
  • Method for preparing printed circuit board embedded resistor ink-jet printing ink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 3

[0041] Mix 0.90g resin (bisphenol A phenolic resin, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate, 4-methylhexahydrophthalic anhydride in a mass ratio of 1:1:1.6) , 0.10g of carbon black particles with a particle size of 40-50nm, and 1.8g of PMA (propylene glycol monomethyl ether acetate) were mixed together, and after stirring, they were placed in ultrasonic waves to disperse for 1 hour. After ultrasonic dispersion, the ink was placed on a hot stage with a temperature of 180°C, supplemented by a stirring speed of 400r / min for 4 hours, and the surface of the carbon black particles was grafted.

[0042] After stirring evenly, drop the embedding resistor ink onto the printed circuit board substrate. The ink spreads on the substrate without delamination, such as image 3 As shown, carbon black is well dispersed in the mixture of resin and solvent. Viscosity testing showed that the ink had a viscosity of 0.85 Pa.s. After the ink is cured for 5 hours, its resistance ...

Embodiment 4

[0044] Mix 0.83g resin (bisphenol A phenolic resin, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate, 4-methylhexahydrophthalic anhydride in a mass ratio of 1:1:1.6) , 0.17g of carbon black particles with a particle size of 40-50nm, and 1.8g of PMA (propylene glycol monomethyl ether acetate) were mixed together, and after stirring, they were placed in ultrasonic waves to disperse for 1 hour. After ultrasonic dispersion, the ink was placed on a hot stage with a temperature of 180°C, supplemented by a stirring speed of 400r / min for 4 hours, and the surface of the carbon black particles was grafted.

[0045] After stirring evenly, drop the embedding resistor ink onto the printed circuit board substrate. The ink spreads on the substrate without delamination, such as image 3 As shown, carbon black is well dispersed in the mixture of resin and solvent. After the ink was cured for 5 hours, its resistance value was 1.2kΩ / □ (thickness 20μm).

Embodiment 5

[0047] Mix 0.90g resin (bisphenol A phenolic resin, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate, 4-methylhexahydrophthalic anhydride in a mass ratio of 1:1:1.6) , 0.10g of carbon black particles with a particle size of 40-50nm and 1.8g of cyclohexanone were mixed together, and after stirring, they were placed in an ultrasonic wave to disperse for 1 hour. After ultrasonic dispersion, the ink was placed on a hot stage with a temperature of 180°C, supplemented by a stirring speed of 400r / min for 4 hours, and the surface of the carbon black particles was grafted.

[0048] After stirring evenly, drop the embedding resistor ink onto the printed circuit board substrate. The ink spreads on the substrate without delamination, such as image 3 As shown, carbon black is well dispersed in the mixture of resin and solvent.

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Abstract

The invention discloses a method for preparing printed circuit board embedded resistor ink-jet printing ink. The method comprises the following steps: firstly, mixing and uniformly stirring the following components in percentage by weight: 20-50% of epoxy resin and curing agent, 2-10% of carbon black grains and the balance of solvent, subsequently putting the uniformly stirred mixture into ultrasonic wave to be subjected to dispersion treatment, putting the mixture subjected to dispersion treatment into a heating stage of 80-200 DEG C, and continuously stirring for 1-12 hours. According to the method, the epoxy resin is used as a binding agent, carbon black as a filling agent and the solvent as a diluent, and the epoxy resin is grafted on the carbon black by using a grafting method, the intersolubility of the carbon black and the solvent is achieved, the dispersity of the carbon black is improved, the ink prepared by using the method is prevented from layering on a substrate, and the resistance of a square resistor formed through curing is high. Therefore, the method is applicable to popularization and application in the technical field of printed circuit board manufacturing.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for manufacturing printed circuit board embedded resistance inkjet printing ink. Background technique [0002] With the development of electronic products in the direction of multi-function, lightweight and high integration, the carrier of signal transmission - the surface of the printed circuit board is gradually crowded. In order to save space on the surface of the circuit board, passive components represented by resistors, inductors and capacitors are moved inside the circuit board. This kind of device embedded in the printed circuit is called embedded passive device, and the corresponding resistance, inductance and capacitance are called embedded resistance, embedded inductance and embedded conductance. The resistor embedding materials currently used mainly include Ni-P, Ni-Cr, carbon paste, LaB 6 Ceramic slurry, etc. [References: (1) H....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/324
Inventor 周国云何为冀仙林王守绪陈苑明唐耀
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA