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Mask plate and production method thereof

A manufacturing method and mask technology, which are applied in the photoengraving process, ion implantation plating, coating and other directions of the pattern surface, can solve the problems that affect the evaporation quality of organic materials, the mask is prone to bending, and the mask area Problems such as unclear boundaries

Active Publication Date: 2014-04-02
TRULY SEMICON
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Problems solved by technology

[0005] However, the existing mask plate is prone to bending under the action of stress, causing the boundary of the mask area to be unclear, and organic material deposition will also be formed in places where organic material does not need to be evaporated, which affects the quality of organic material evaporation

Method used

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  • Mask plate and production method thereof
  • Mask plate and production method thereof
  • Mask plate and production method thereof

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Embodiment Construction

[0044] As mentioned in the background section, in the prior art, during the evaporation of organic materials during the OLED manufacturing process, since the mask plate is prone to bending, the boundaries of the deposited organic materials are not clear, and the quality of organic material evaporation is poor.

[0045] The inventors found that the reason for the above phenomenon is that the thickness of the existing mask plate is relatively thin, and as the size of the organic light-emitting device becomes larger and larger, the mask plate formed by the traditional method will be damaged to a certain extent under the action of stress. The distortion of the organic material causes the organic material to be deposited in the area where the organic material does not need to be deposited during the evaporation of the organic material, which affects the preparation of the OLED light-emitting area; and in the process of evaporating the organic material, the temperature is also As the...

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Abstract

The invention provides a mask plate and a production method thereof. The mask plate is applied in a vacuum evaporation process of an organic light emitting diode display device, and comprises a mask frame and a mask fixed on the mask frame, wherein a plurality of mask pattern blocks are arranged on the mask, and include through holes penetrating through the mask; the surface of the mask towards the mask frame further comprises supporting bars arranged on the other areas besides the mask pattern blocks; the thickness of the supporting bars is greater than 0.03 mm. As the supporting bars are arranged in the areas besides the mask pattern blocks, the thickness of the supporting bars is greater than the thickness of the areas where the mask pattern blocks are positioned on; the supporting force can be provided to the mask pattern blocks to a certain degree so as to reinforce the mechanical strength of the mask plate and to prevent the mask plate from being bent under the stress effect. Meanwhile, the invention further provides a method for producing the mask plate by repeatedly etching; the evaporation quality of organic materials can be guaranteed.

Description

technical field [0001] The invention relates to the manufacturing field of organic light-emitting diode displays, and more specifically relates to a mask plate and a manufacturing method thereof. Background technique [0002] Organic electroluminescent devices (OLEDs) are considered to be the next generation of flat panel display devices due to their advantages such as low cost, high brightness, high contrast, fast response, low power consumption, wide viewing angle, thin appearance, and flexible display. Liquid crystal displays (LCDs) at this stage. OLEDs have an anode, an organic light-emitting layer, and a cathode sequentially stacked on a glass substrate. Materials for the organic light-emitting layer are generally classified into macromolecular organic materials and small molecular organic materials. For small molecule organic materials, vacuum evaporation is usually used to form various organic functional layers on the anode, and finally the cathode of the device is ...

Claims

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Application Information

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IPC IPC(8): C23C14/04G03F1/64
Inventor 谢志生苏君海柯贤军何基强李建华
Owner TRULY SEMICON
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