Hot forging and molding process for oxygen free copper material
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGXI AUDY BRASSWORK
- Publication Date
- 2014-04-09
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Abstract
Description
technical field
[0001] The invention relates to the field of chemical industry, in particular to a hot forging process for oxygen-free copper material products. Background technique
[0002] Oxygen-free copper means that the oxygen content is not more than 0.003% (mass fraction), and the total impurity content is not more than 0.03% (mass fraction, No. 1 oxygen-free copper TU1) or not more than 0.05% (mass fraction, No. 2 oxygen-free copper TU2) Pure copper, the purity of copper is greater than 99.95%. Oxygen-free copper has no hydrogen embrittlement, high electrical conductivity, good processing performance, welding performance, corrosion resistance and low temperature performance.
[0003] Due to the characteristics of oxygen-free copper, in addition to the high requirements for the raw materials for processing and producing oxygen-free copper, it is also required that impurities and oxygen should not be brought in during the production and processing of oxygen-free coppe...