Thermoplastic resin composition and molded article thereof

A thermoplastic resin and composition technology, which is applied in the field of thermoplastic resin composition and its molded products, can solve the problems of complicated processing procedures and insufficient adhesion of coatings, and achieve excellent heat resistance and laser marking effects

Inactive Publication Date: 2014-04-09
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in marking with ink, there are problems such as insufficient paint adhesion and complicated processing steps.

Method used

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  • Thermoplastic resin composition and molded article thereof
  • Thermoplastic resin composition and molded article thereof
  • Thermoplastic resin composition and molded article thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～29

[0174] Examples 1-29, Comparative Examples 1-11

[0175] Using a Toshiba Machine Co., Ltd. TEM35B twin-screw extruder equipped with a side feeder, the compounding amounts shown in Tables 1 to 3 were added from the hopper to 100 parts by weight of the thermoplastic resin (a-1 to a-4). Put in additives (b-1~b-4, z-1~z-4), put in filling materials (c-1, c-2) from the side feeder with the compounding amount shown in Table 1~3, and put the materials into The cylinder temperature was set to the melting point of the thermoplastic resin + 10° C., and melt kneading was performed to form pellets. After drying the obtained pellets of the thermoplastic resin composition with hot air, the following evaluations (1) to (4) were performed. The results are shown in Tables 1-3.

Embodiment 30、 comparative example 12

[0177] Using a Toshiba Machine Co., Ltd. TEM35B twin-screw extruder equipped with a side feeder, with respect to 100 parts by weight of the two thermoplastic resins (a-1:a-4=3:7 (weight ratio)), the following table Additives (b-1, z-2) and Epicott 191P (glycidyl ester type epoxy resin) manufactured by Japan Epoch Resin Co., Ltd. as a compatibilizer are put into the compounding amount shown in 2 to 3 from the hopper, and are shown in Table 2 to The compounding amount shown in 3 was charged into the filler (c-1) from the side feeder, and the temperature of the cylinder was set at the melting point of the higher thermoplastic resin + 10°C, and melt kneaded to form pellets. After drying the obtained pellets of the thermoplastic resin composition with hot air, the following evaluations (1) to (4) were performed. The results are shown in Tables 2-3.

[0178] (1) Laser marking evaluation

[0179] Supply the thermoplastic resin composition to a Fanack α30C injection molding machine ...

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Abstract

To provide: a thermoplastic resin composition which has high laser marking properties and heat resistance; and a molded article which is formed from the thermoplastic resin composition. A thermoplastic resin composition which contains 0.001-10 parts by weight of a metal complex (b) that is configured of a monodentate or bidentate ligand and at least one metal selected from the group consisting of copper, zinc, nickel, manganese, cobalt, chromium and tin and/or a salt thereof per 100 parts by weight of a thermoplastic resin (a) that is a liquid crystalline polyester and/or a polyphenylene sulfide.

Description

technical field [0001] The disclosure of Japanese Patent Application No. 2011-285056 of Toray Corporation, and the disclosure of Japanese Patent Laid-Open No. 2012-096360 are incorporated herein by reference. [0002] The present invention relates to thermoplastic resin compositions. In more detail, it is related with the thermoplastic resin composition excellent in laser marking property and heat resistance, and its molded article. Background technique [0003] Liquid crystalline polyester is excellent in heat resistance, fluidity, and dimensional stability due to its liquid crystal structure. Therefore, the demand for the above-mentioned liquid crystalline polyester is expanding mainly in small electric and electronic components that require these properties. In addition, polyphenylene sulfide (hereinafter sometimes abbreviated as PPS) has excellent heat resistance, chemical resistance, and electrical insulation, and is used in various electrical and electronic parts, ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/00C08J7/00C08K5/37C08K5/47C08L81/02
CPCC08K5/47C08K5/37C08K5/56C08L67/00C08K5/0091C08J7/18C08L81/02B41M5/267C08G75/00C08L81/00C08L101/00C09K19/3809C09K2019/523Y10T428/24802C08L67/03C08L101/12C08L67/02
Inventor 宫本皓平滨口美都繁梅津秀之
Owner TORAY IND INC
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