Check patentability & draft patents in minutes with Patsnap Eureka AI!

Reconstruction-equivalent chirp and equivalent half apodization-based DFB semiconductor laser and preparation method thereof

An equivalent chirp and laser technology, applied in semiconductor laser devices, laser devices, devices that control laser output parameters, etc., can solve the unresolved negative effects of random phase, it is difficult to separate and control, and cannot be changed by coating methods Issues such as the ratio of the output power of the two ends of the DFB semiconductor laser

Inactive Publication Date: 2014-04-30
NANJING UNIV
View PDF14 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While the coupling coefficient depends on the waveguide parameters, it is difficult to separate the control
In addition, if the laser is a separate device, the output laser power of the two end faces of the laser can be distributed by coating one end face of the laser with a high-reflection film and the other end face with an anti-reflection film, but the high-reflection film will bring random The influence of phase, the negative impact of random phase on the laser is uncontrollable, and the negative effect of random phase has not been solved yet
Moreover, for photonic integrated chips (PICs), various devices such as monitors, lasers, modulators, multiplexers, etc. are integrated together through selective area epitaxial growth technology or docking growth technology, and the DFB cannot be changed by coating methods. The ratio of the output power of the two ends of the semiconductor laser

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reconstruction-equivalent chirp and equivalent half apodization-based DFB semiconductor laser and preparation method thereof
  • Reconstruction-equivalent chirp and equivalent half apodization-based DFB semiconductor laser and preparation method thereof
  • Reconstruction-equivalent chirp and equivalent half apodization-based DFB semiconductor laser and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] The purpose of the present invention is to effectively and reasonably combine the reconstruction-equivalent chirp technology (REC) and the equivalent half-edge apodization technology on the common technology platform of sampling grating, to design and manufacture a The planar sampling Bragg grating of the effective output optical power of the end face of the semiconductor laser proposes a new idea and new process for manufacturing DFB semiconductor lasers.

[0055] 1. The principle and method of increasing the effective output optical power of the laser facet based on reconstruction-equivalent chirp and equivalent half-edge apodization

[0056] In the DFB semiconductor laser based on reconstruction-equivalent chirp and equivalent half-edge apodization and its preparation method according to the present invention, the grating structure of the laser is a sampling Bragg grating based on reconstruction-equivalent chirp technology, and in the grating The phase shift is intro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a preparation method of a reconstruction-equivalent chirp (REC) and equivalent half apodization-based distributed feed-back (DFB) semiconductor laser. The grating structure of the laser is formed by reconstruction-equivalent chirp technique-based sampled Bragg gratings. The phase shifts of the gratings are introduced by using the equivalent chirp technology design and are called as equivalent phase shifts; and the positions of the equivalent phase shifts are located in regional ranges of + / -20% of the sampled Bragg grating centers. One equivalent phase shift is shifted into all shadow gratings except one at the 0 level. The apodization is realized equivalently by changing sampling structures, namely, duty ratios, of the sampled gratings gradually along the cavity length direction of the laser; and the equivalent apodization is only introduced into the sampled gratings at one sides of the equivalent phase shift regions, so that the equivalent half apodization is realized.

Description

technical field [0001] The invention belongs to the field of optoelectronic technology, relates to optical fiber communication, photonic integrated chip, photoelectric sensor and other photoelectric information processing, and proposes an equivalent method based on the reconstruction-equivalent chirp and equivalent half-edge apodized DFB semiconductor laser and its preparation method A new idea for the design and fabrication of half-apodized sampled Bragg gratings is based on reconstruction-equivalent chirp and equivalent half-apodized sampled Bragg gratings and their applications in DFB semiconductor lasers and photonic integrated chips. Background technique [0002] The photon integration technology that has appeared in recent years conforms to the development of the times and is opening a new era of optical networks. Photon integration technology is considered to be the most cutting-edge and promising field of optical fiber communication. In the Silicon Valley laboratory...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01S5/06H01S5/12H01S5/40
Inventor 郑俊守陈向飞李连艳
Owner NANJING UNIV
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More