Resin composition, resin sheet, resin sheet with metal foil, hardened resin sheet, structure, and semiconductor device for power or light source
A technology of resin composition and resin cured product, which is applied in the direction of semiconductor devices, electric solid devices, electrical components, etc., can solve the problem that the insulation is difficult to say, and achieve the effect of high thermal conductivity
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Embodiment 2～12、 comparative example 4～5
[0285] According to the steps of Example 1, with the materials shown in Table 2, a cured resin was obtained. In addition, curing accelerators, coupling agents, and dispersants which are materials not described in Table 2 were mixed in the same amount as in Example 1.
[0286] 〔Evaluation method〕
[0287] About the resin composition obtained above, it carried out similarly to the above, and measured the thermal conductivity and glass transition temperature of the cured resin. In addition, the flexibility of the resin composition and the dielectric breakdown voltage of the cured resin formed of the resin composition were evaluated as follows. The results are shown in Table 2.
[0288] (softness evaluation)
[0289] The produced B-stage sheet was cut out to a length of 100 mm and a width of 10 mm, and the PET film on the surface was removed. Attach the sample to a jig stacked on a multi-stage aluminum circular plate with a diameter of 20 to 140mm and a 20mm step pitch. When t...
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